EP20K30EFC256-1

IC FPGA 256FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA

Quantity 1,026 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-BGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O128Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EFC256-1 – APEX‑20KE® Field Programmable Gate Array (FPGA), 1,200 logic elements

The EP20K30EFC256-1 is a commercial-grade, surface-mount FPGA from the APEX‑20K family that integrates LUT-based logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) designs. With 1,200 logic elements, approximately 0.025 Mbits (24,576 bits) of embedded RAM, and up to 128 user I/O pins in a 256‑LBGA package, it targets moderate-density digital designs requiring flexible I/O, embedded memory and low-voltage operation.

Designed for embedded applications and interface-intensive designs, this device combines on-chip memory and dedicated logic structures with family-level features such as flexible clock management and high-speed I/O support to simplify system integration and accelerate development.

Key Features

  • Core Architecture  MultiCore architecture integrating look-up table (LUT) logic and product-term logic, providing a versatile logic fabric suitable for register-intensive and combinatorial functions (APEX 20K family).
  • Logic Resources  1,200 logic elements and a maximum of 113,000 system gates, enabling moderate-density custom logic implementations.
  • Embedded Memory  Approximately 0.025 Mbits (24,576 bits) of on-chip RAM suitable for small FIFOs, buffers and configuration storage.
  • I/O and Interfaces  Up to 128 user I/O pins with MultiVolt I/O interface support across common levels, enabling direct interfacing with a range of external devices and buses.
  • Clock Management  Flexible clock management circuitry (family feature) including phase-locked loops (PLLs), a low-skew clock tree and multiple global clock signals to support synchronous designs.
  • Low‑Voltage Operation  Internal supply designed for nominal 1.8 V operation (specified device supply range 1.71 V to 1.89 V) to support low-power system designs.
  • Package and Mounting  256‑LBGA (256‑BGA, 27×27) surface-mount package for compact PCB footprint and reliable board-level assembly.
  • Commercial Grade and Environmental  Commercial temperature range of 0 °C to 85 °C and RoHS‑compliant construction.

Typical Applications

  • Embedded control and SOPC integration  Implement compact system logic and small embedded subsystems that leverage on-chip RAM and LUT logic for control, state machines and glue logic.
  • Interface bridging and protocol adaptation  Use the device’s MultiVolt I/O and abundant I/O pins to bridge between different voltage domains and implement protocol translators or bus interfaces.
  • Memory buffering and FIFO  Deploy embedded RAM blocks for small FIFO buffers and temporary data storage in streaming or packet-handling designs.
  • Prototyping and custom digital functions  Rapidly prototype moderate-density logic, glue logic and timing-critical paths using the APEX‑20K architecture.

Unique Advantages

  • Established APEX‑20K architecture: Leverages MultiCore LUT and embedded system block concepts from the APEX family for predictable integration of logic and memory.
  • Balanced resource set: 1,200 logic elements paired with 24,576 bits of embedded RAM and 128 I/O pins fits designs that need moderate logic capacity with on-chip memory.
  • Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing with a variety of external devices across common voltage domains.
  • Compact, board-ready package: 256‑LBGA footprint provides a high-density mounting option for space-constrained PCBs.
  • Low-voltage, commercial operation: Specified 1.71 V to 1.89 V supply range and 0 °C to 85 °C operating temperature for typical commercial electronics environments.
  • RoHS compliant: Manufactured to meet RoHS environmental requirements for lead-free assembly.

Why Choose EP20K30EFC256-1?

The EP20K30EFC256-1 delivers a practical combination of logic capacity, on-chip RAM and flexible I/O in a compact 256‑LBGA package, making it suitable for commercial embedded designs that require SOPC-style integration, interface flexibility and modest memory buffering. As a member of the APEX‑20K family, it aligns with family-level features such as PLL-based clock management and MultiVolt I/O to help streamline integration into mixed-voltage systems.

This device is well-suited to engineers and procurement teams specifying moderate-density FPGAs for commercial applications where documented family capabilities, RoHS compliance and compact packaging are priorities.

Request a quote or submit an inquiry for the EP20K30EFC256-1 to get pricing, availability and additional procurement information.

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