EP20K30EFC256-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA |
|---|---|
| Quantity | 1,026 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-BGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 128 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 120 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | 113000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP20K30EFC256-1 – APEX‑20KE® Field Programmable Gate Array (FPGA), 1,200 logic elements
The EP20K30EFC256-1 is a commercial-grade, surface-mount FPGA from the APEX‑20K family that integrates LUT-based logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) designs. With 1,200 logic elements, approximately 0.025 Mbits (24,576 bits) of embedded RAM, and up to 128 user I/O pins in a 256‑LBGA package, it targets moderate-density digital designs requiring flexible I/O, embedded memory and low-voltage operation.
Designed for embedded applications and interface-intensive designs, this device combines on-chip memory and dedicated logic structures with family-level features such as flexible clock management and high-speed I/O support to simplify system integration and accelerate development.
Key Features
- Core Architecture MultiCore architecture integrating look-up table (LUT) logic and product-term logic, providing a versatile logic fabric suitable for register-intensive and combinatorial functions (APEX 20K family).
- Logic Resources 1,200 logic elements and a maximum of 113,000 system gates, enabling moderate-density custom logic implementations.
- Embedded Memory Approximately 0.025 Mbits (24,576 bits) of on-chip RAM suitable for small FIFOs, buffers and configuration storage.
- I/O and Interfaces Up to 128 user I/O pins with MultiVolt I/O interface support across common levels, enabling direct interfacing with a range of external devices and buses.
- Clock Management Flexible clock management circuitry (family feature) including phase-locked loops (PLLs), a low-skew clock tree and multiple global clock signals to support synchronous designs.
- Low‑Voltage Operation Internal supply designed for nominal 1.8 V operation (specified device supply range 1.71 V to 1.89 V) to support low-power system designs.
- Package and Mounting 256‑LBGA (256‑BGA, 27×27) surface-mount package for compact PCB footprint and reliable board-level assembly.
- Commercial Grade and Environmental Commercial temperature range of 0 °C to 85 °C and RoHS‑compliant construction.
Typical Applications
- Embedded control and SOPC integration Implement compact system logic and small embedded subsystems that leverage on-chip RAM and LUT logic for control, state machines and glue logic.
- Interface bridging and protocol adaptation Use the device’s MultiVolt I/O and abundant I/O pins to bridge between different voltage domains and implement protocol translators or bus interfaces.
- Memory buffering and FIFO Deploy embedded RAM blocks for small FIFO buffers and temporary data storage in streaming or packet-handling designs.
- Prototyping and custom digital functions Rapidly prototype moderate-density logic, glue logic and timing-critical paths using the APEX‑20K architecture.
Unique Advantages
- Established APEX‑20K architecture: Leverages MultiCore LUT and embedded system block concepts from the APEX family for predictable integration of logic and memory.
- Balanced resource set: 1,200 logic elements paired with 24,576 bits of embedded RAM and 128 I/O pins fits designs that need moderate logic capacity with on-chip memory.
- Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing with a variety of external devices across common voltage domains.
- Compact, board-ready package: 256‑LBGA footprint provides a high-density mounting option for space-constrained PCBs.
- Low-voltage, commercial operation: Specified 1.71 V to 1.89 V supply range and 0 °C to 85 °C operating temperature for typical commercial electronics environments.
- RoHS compliant: Manufactured to meet RoHS environmental requirements for lead-free assembly.
Why Choose EP20K30EFC256-1?
The EP20K30EFC256-1 delivers a practical combination of logic capacity, on-chip RAM and flexible I/O in a compact 256‑LBGA package, making it suitable for commercial embedded designs that require SOPC-style integration, interface flexibility and modest memory buffering. As a member of the APEX‑20K family, it aligns with family-level features such as PLL-based clock management and MultiVolt I/O to help streamline integration into mixed-voltage systems.
This device is well-suited to engineers and procurement teams specifying moderate-density FPGAs for commercial applications where documented family capabilities, RoHS compliance and compact packaging are priorities.
Request a quote or submit an inquiry for the EP20K30EFC256-1 to get pricing, availability and additional procurement information.

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