EP20K30EFC256-3

IC FPGA 256FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA

Quantity 571 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-BGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O128Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EFC256-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA

The EP20K30EFC256-3 is a commercial-grade FPGA from Intel’s APEX 20K family. It implements a MultiCore architecture that integrates lookup-table logic, product-term logic, and embedded memory, providing a compact, programmable logic solution for commercial embedded designs.

With 1,200 logic elements, approximately 24,576 bits of embedded RAM, 128 I/O pins and a 256‑LBGA surface-mount package, this device targets mid-range programmable logic tasks that require flexible I/O, on‑chip memory and configurable clocking within a 0 °C to 85 °C operating range.

Key Features

  • Core Architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded memory for balanced register-intensive and combinatorial functions.
  • Logic Capacity  1,200 logic elements (LEs) and 113,000 system gates to implement moderate-complexity logic and control functions.
  • Embedded Memory  Approximately 0.0246 Mbits (24,576 bits) of on-chip RAM suitable for FIFOs, small buffers and local data storage.
  • I/O and Interface  128 user I/O pins with MultiVolt I/O support across common interface levels and programmable I/O features for flexible board-level integration.
  • Clock Management  Integrated clock resources including support for phase-locked loops (PLLs), a built-in low-skew clock tree and multiple global clock signals for synchronized system timing.
  • Power and Supply  Internal voltage supply specified at 1.71 V to 1.89 V to support the device core; designed for low-power operation within that supply range.
  • Package & Mounting  256-LBGA (supplier package: 256-BGA 27×27) in a surface-mount configuration for compact board layouts.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature, suitable for commercial embedded applications.
  • Environmental Compliance  RoHS‑compliant for lead‑free manufacturing and assembly processes.

Typical Applications

  • Embedded Control and Prototyping  Implement finite state machines, control logic and prototype systems using the device’s logic elements and embedded memory for rapid iteration.
  • Memory Interface and Buffering  Use on‑chip RAM and configurable I/O to implement small FIFOs, dual-port RAM functions and buffering for external memory interfaces.
  • High-Speed I/O Bridging  Employ the MultiVolt I/O support and programmable I/O features for level translation and interfacing between differing voltage domains on mixed-signal boards.
  • Clocked Data Processing  Leverage integrated PLLs and low-skew clock tree resources for synchronized data paths and timing-critical logic blocks.

Unique Advantages

  • Balanced Integration:  Combines 1,200 logic elements with embedded RAM and dedicated product-term logic to consolidate control, buffering and combinatorial functions on a single device.
  • Flexible I/O:  128 I/O pins with MultiVolt support enable straightforward interfacing to a wide range of peripherals and legacy interfaces without extensive level-shifting components.
  • Compact, Surface-Mount Package:  256-LBGA (27×27) package supports dense PCB layouts while maintaining a practical footprint for compact systems.
  • Commercial-Grade Reliability:  Designed and specified for 0 °C to 85 °C operation with RoHS compliance for mainstream commercial products.
  • Onboard Clocking Resources:  Integrated PLLs and global clock features reduce the need for external clock-management ICs, simplifying board design.

Why Choose EP20K30EFC256-3?

The EP20K30EFC256-3 delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact 256‑LBGA package. Its MultiCore APEX 20K architecture and on‑chip clocking resources make it well suited for commercial embedded designs that require configurable logic, localized buffering and reliable timing.

This device is a fit for engineers and teams developing mid-range programmable solutions where board space, I/O flexibility and integration reduce BOM complexity and speed time to market, backed by Intel’s APEX 20K family design heritage.

Request a quote or submit an inquiry to receive pricing and availability for EP20K30EFC256-3 and to discuss how this FPGA can fit into your next commercial embedded design.

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