EP20K30EFC256-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA |
|---|---|
| Quantity | 571 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-BGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 128 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 120 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | 113000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP20K30EFC256-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA
The EP20K30EFC256-3 is a commercial-grade FPGA from Intel’s APEX 20K family. It implements a MultiCore architecture that integrates lookup-table logic, product-term logic, and embedded memory, providing a compact, programmable logic solution for commercial embedded designs.
With 1,200 logic elements, approximately 24,576 bits of embedded RAM, 128 I/O pins and a 256‑LBGA surface-mount package, this device targets mid-range programmable logic tasks that require flexible I/O, on‑chip memory and configurable clocking within a 0 °C to 85 °C operating range.
Key Features
- Core Architecture MultiCore architecture integrating LUT logic, product-term logic, and embedded memory for balanced register-intensive and combinatorial functions.
- Logic Capacity 1,200 logic elements (LEs) and 113,000 system gates to implement moderate-complexity logic and control functions.
- Embedded Memory Approximately 0.0246 Mbits (24,576 bits) of on-chip RAM suitable for FIFOs, small buffers and local data storage.
- I/O and Interface 128 user I/O pins with MultiVolt I/O support across common interface levels and programmable I/O features for flexible board-level integration.
- Clock Management Integrated clock resources including support for phase-locked loops (PLLs), a built-in low-skew clock tree and multiple global clock signals for synchronized system timing.
- Power and Supply Internal voltage supply specified at 1.71 V to 1.89 V to support the device core; designed for low-power operation within that supply range.
- Package & Mounting 256-LBGA (supplier package: 256-BGA 27×27) in a surface-mount configuration for compact board layouts.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature, suitable for commercial embedded applications.
- Environmental Compliance RoHS‑compliant for lead‑free manufacturing and assembly processes.
Typical Applications
- Embedded Control and Prototyping Implement finite state machines, control logic and prototype systems using the device’s logic elements and embedded memory for rapid iteration.
- Memory Interface and Buffering Use on‑chip RAM and configurable I/O to implement small FIFOs, dual-port RAM functions and buffering for external memory interfaces.
- High-Speed I/O Bridging Employ the MultiVolt I/O support and programmable I/O features for level translation and interfacing between differing voltage domains on mixed-signal boards.
- Clocked Data Processing Leverage integrated PLLs and low-skew clock tree resources for synchronized data paths and timing-critical logic blocks.
Unique Advantages
- Balanced Integration: Combines 1,200 logic elements with embedded RAM and dedicated product-term logic to consolidate control, buffering and combinatorial functions on a single device.
- Flexible I/O: 128 I/O pins with MultiVolt support enable straightforward interfacing to a wide range of peripherals and legacy interfaces without extensive level-shifting components.
- Compact, Surface-Mount Package: 256-LBGA (27×27) package supports dense PCB layouts while maintaining a practical footprint for compact systems.
- Commercial-Grade Reliability: Designed and specified for 0 °C to 85 °C operation with RoHS compliance for mainstream commercial products.
- Onboard Clocking Resources: Integrated PLLs and global clock features reduce the need for external clock-management ICs, simplifying board design.
Why Choose EP20K30EFC256-3?
The EP20K30EFC256-3 delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact 256‑LBGA package. Its MultiCore APEX 20K architecture and on‑chip clocking resources make it well suited for commercial embedded designs that require configurable logic, localized buffering and reliable timing.
This device is a fit for engineers and teams developing mid-range programmable solutions where board space, I/O flexibility and integration reduce BOM complexity and speed time to market, backed by Intel’s APEX 20K family design heritage.
Request a quote or submit an inquiry to receive pricing and availability for EP20K30EFC256-3 and to discuss how this FPGA can fit into your next commercial embedded design.

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