EP20K30EFC256-2

IC FPGA 256FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 256-LBGA

Quantity 1,754 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-BGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O128Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EFC256-2 – APEX-20KE® FPGA, 1,200 logic elements, 24,576-bit embedded RAM, 256-LBGA

The EP20K30EFC256-2 is an APEX-20KE family field-programmable gate array (FPGA) in a 256-LBGA (27×27) package, optimized for commercial applications. It implements the APEX MultiCore architecture, combining look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) to consolidate logic and memory functions on-chip.

With 1,200 logic elements, 24,576 bits of on-chip RAM, 128 user I/O pins and a commercial operating range of 0 °C to 85 °C, this device targets embedded systems and high-density logic integration where compact packaging, flexible I/O and low-power operation are important.

Key Features

  • Core architecture (MultiCore)  The APEX MultiCore architecture integrates LUT-based logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive and memory functions on-chip.
  • Logic resources  1,200 logic elements (LEs) supporting up to 113,000 system gates enables medium-density programmable logic implementations.
  • Embedded memory  24,576 total RAM bits of ESB memory for FIFOs, dual-port RAM and CAM-style structures suitable for local buffering and state storage.
  • I/O capability  128 user I/O pins with MultiVolt I/O interface support (family-level capability) for interfacing to a range of voltage domains and external devices.
  • Clock management  Family-level clock features include up to four phase-locked loops (PLLs), a built-in low-skew clock tree and provision for up to eight global clock signals to simplify timing distribution.
  • Power and voltage  Internal supply and device operation targeted around 1.8 V (specified voltage supply range 1.71 V to 1.89 V), with family features for programmable power-saving modes.
  • Package and mounting  256-LBGA (27×27) surface-mount package providing a compact footprint for space-constrained PCBs.
  • Commercial grade and compliance  Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

  • Embedded control and processing  On-chip LUT logic and ESB memory enable control state machines, protocol handling and local buffering in embedded systems.
  • High-speed interfaces and bridging  MultiVolt I/O support and family-level I/O features help implement interface bridging and protocol adaptation between different voltage domains.
  • Memory interfacing and buffering  ESB RAM and dedicated interconnect support use as local FIFOs and memory controllers for external memory interfaces.
  • Communication endpoints  Programmable clock management and flexible I/O are suitable for mid-range communication endpoints requiring deterministic clocking and moderate I/O counts.

Unique Advantages

  • Integrated logic and memory:  The MultiCore architecture with ESBs consolidates logic and RAM on-chip, reducing external component count for buffering and state storage.
  • Balanced resource mix:  1,200 logic elements paired with 24,576 bits of embedded RAM and 128 I/O pins offers a practical balance for medium-density designs.
  • Flexible clocking:  Family-level PLLs and multiple global clocks simplify implementation of complex timing domains and reduce board-level clocking requirements.
  • Compact, surface-mount package:  The 256-LBGA (27×27) package enables high-density PCB layouts while maintaining robust I/O connectivity.
  • Commercial temperature and RoHS compliance:  Specified 0 °C to 85 °C operation and RoHS compliance support mainstream commercial product development and manufacturing requirements.

Why Choose EP20K30EFC256-2?

The EP20K30EFC256-2 positions itself as a mid-density, commercial-grade FPGA option within the APEX-20K family, offering a practical combination of logic elements, embedded RAM and I/O for embedded designs. Its MultiCore architecture and family-level clock and I/O features provide the on-chip integration designers need to reduce external components and simplify board-level design.

This device is well suited for developers seeking a commercially-rated FPGA from the APEX-20K family with compact 256-LBGA packaging, low-power design considerations and clearly specified logic and memory resources for medium-complexity applications.

Request a quote or submit a pricing inquiry for EP20K30EFC256-2 to receive availability and lead-time information for your project needs.

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