EP20K200RC240-2X
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,720 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 174 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200RC240-2X – APEX-20K® Field Programmable Gate Array (FPGA), 8,320 logic elements, 106,496‑bit RAM, 240‑BFQFP (Exposed Pad)
The EP20K200RC240-2X is an APEX‑20K family FPGA IC from Intel designed for system-on-a-programmable-chip (SOPC) integration. It combines MultiCore architecture with look‑up table (LUT) logic, product‑term logic and embedded system blocks to support integrated logic and memory functions.
With 8,320 logic elements, approximately 106,496 bits of embedded memory, flexible I/O and commercial‑grade temperature range, this device targets programmable logic applications that require moderate density, on‑chip memory and configurable I/O in a 240‑pin BFQFP exposed‑pad package.
Key Features
- MultiCore architecture Integrates LUT logic, product‑term logic and embedded system blocks (ESBs) to implement register‑intensive and memory functions.
- Logic capacity 8,320 logic elements (LEs) supporting up to 526,000 system gates for mid‑range programmable designs.
- Embedded memory Approximately 106,496 bits of on‑chip RAM for FIFOs, dual‑port RAM and other memory functions implemented in ESBs.
- I/O and interface flexibility 174 user I/O pins with MultiVolt I/O interface support to work with common interface voltage levels; advanced I/O features described in the APEX‑20K family support high‑speed memory interfaces and differential signaling.
- Clock management Up to four PLLs and a low‑skew clock tree with features such as ClockLock, ClockBoost and programmable ClockShift for phase and delay control.
- Low‑power design Designed for lower power operation with an internal voltage supply region specified at 2.375 V to 2.625 V and power‑saving options in the ESBs.
- Package and mounting 240‑BFQFP with exposed pad (supplier package: 240‑RQFP, 32×32) optimized for surface‑mount assembly.
- Commercial temperature grade Rated for 0 °C to 85 °C operation for commercial‑grade applications.
- Standards and memory support Family datasheet documents support for PCI (3.3 V operation) and high‑speed external memories such as DDR SDRAM and ZBT SRAM.
Typical Applications
- Embedded systems Implement integrated logic and memory functions within compact, programmable subsystems using on‑chip ESBs and LUT resources.
- Custom I/O and interface bridging Use the device’s MultiVolt I/O support and advanced I/O features to create protocol bridges, bus interfaces and custom peripheral controllers.
- Memory controllers and buffering Leverage the embedded RAM and ESB architecture to implement FIFOs, dual‑port RAM and controllers for external DDR/SDRAM and ZBT SRAM.
- Clocked digital logic Use the integrated PLLs and clock distribution features to implement synchronous logic, clock multiplication/division and phase adjustments.
Unique Advantages
- Integrated memory and logic: ESBs plus LUTs let you implement both register‑intensive logic and on‑chip memory functions without external components.
- Flexible clocking: Multiple PLLs and programmable clock features provide clock discipline and phase control for timing‑sensitive designs.
- Reduced BOM and board area: On‑chip RAM and product‑term logic can eliminate discrete memory or glue logic in many mid‑density designs.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, enabling deployment in standard commercial environments.
- Package choice for surface‑mount assembly: 240‑BFQFP with exposed pad supports thermal management and is compatible with standard SMT processes.
Why Choose EP20K200RC240-2X?
The EP20K200RC240-2X delivers a balanced combination of logic density, on‑chip memory and flexible I/O in a commercially rated APEX‑20K FPGA. Its MultiCore architecture and embedded system blocks make it a practical choice for designs that need integrated memory structures, programmable logic and advanced clock control without escalating component count.
This device is well suited to engineering teams building mid‑range programmable systems that require predictable logic resources (8,320 LEs), defined embedded memory (≈106,496 bits) and a robust set of clock and I/O features, all in a 240‑pin BFQFP exposed‑pad package.
Request a quote or submit a procurement inquiry for the EP20K200RC240-2X to get pricing and availability details for your next design.

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