EP20K200FC484-2XV

The EP20K200FC484-2XV is an APEX-20K series FPGA offering a balanced mix of logic capacity, embedded memory, and I/O density for commercial applications. Based on the APEX 20K family architecture, it integrates MultiCore-style resources including lookup-table logic and embedded system blocks for memory and FIFO implementations, making it suitable for system-level integration and board-level programmable logic tasks.

Designed for commercial-grade deployments, this device delivers 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 382 user I/O pins in a 484-BBGA surface-mount package, providing a compact, RoHS-compliant solution for a wide range of digital designs.

Key Features

• Logic Capacity  8,320 logic elements (LEs) for implementing register-intensive and combinatorial functions.
• Embedded Memory  Approximately 0.106 Mbits (106,496 bits) of on-chip RAM suitable for FIFOs, small buffers, and dual-port RAM structures.
• I/O and Interface  382 user I/O pins to support dense external connectivity and high-speed interfaces.
• Package and Mounting  484-BBGA (23×23) surface-mount package for compact board integration and high pin count routing.
• Power and Supply  Internal/primary supply specified at 2.375 V to 2.625 V for core operation.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation for typical commercial deployments.
• RoHS Compliance  RoHS-compliant manufacturing to meet common environmental requirements.
• APEX 20K Series Architecture  Series-level features include MultiCore architecture with LUT logic, product-term logic, embedded system blocks (ESBs) for memory and FIFO functions, and flexible clock management (as provided by the APEX 20K family).

Typical Applications

• Communications and Networking  Use for protocol bridging, packet buffering and custom interface logic where dense I/O and on-chip memory are required.
• Memory Interface and Controllers  Suitable for board-level memory control tasks such as FIFO buffering and interfacing with external SDRAM or SRAM via embedded memory resources.
• Embedded System Integration  Implement system blocks, custom peripherals, and SOPC-style integrations using the device’s embedded memory and logic elements.
• High-speed I/O Modules  Deploy where numerous I/O and flexible I/O signaling are needed for data acquisition, sensor aggregation, or I/O expansion.

Unique Advantages

• Balanced Logic and Memory: 8,320 logic elements combined with about 106,496 bits of embedded RAM enable compact implementation of control, buffering, and state-machine functions without off-chip memory.
• High I/O Density: 382 user I/Os provide extensive external connectivity to support parallel buses, multiple peripherals, and board-level interconnects.
• Compact Surface-Mount Packaging: 484-BBGA (23×23) package offers a high pin count in a compact footprint for space-constrained designs.
• Commercial-Grade Robustness: Rated for 0 °C to 85 °C and RoHS-compliant, suitable for a wide range of commercial electronics applications.
• Series-Level Integration: Leverages APEX 20K family features such as embedded system blocks and flexible clocking to simplify common FPGA design tasks.

Why Choose EP20K200FC484-2XV?

The EP20K200FC484-2XV positions itself as a capable, commercial-grade FPGA option within the APEX 20K family, delivering a solid combination of logic elements, embedded RAM, and high I/O count in a compact 484-BBGA package. Its defined supply and temperature ratings, together with RoHS compliance, make it a practical choice for designers needing board-level programmable logic with integrated memory resources and flexible interfacing.

This device is well suited to designers building communications modules, embedded controllers, memory interface logic, and high-density I/O subsystems who require a predictable, series-backed architecture and the integration benefits of APEX 20K family features.

Request a quote or submit a pricing and availability inquiry to obtain lead-time and ordering information for the EP20K200FC484-2XV.