EP20K200EFI672-2X

IC FPGA 376 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 672-BBGA

Quantity 1,156 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFI672-2X – APEX-20KE® FPGA, 8,320 Logic Elements, 106,496 bits RAM, 672-BBGA

The EP20K200EFI672-2X is an Intel APEX 20K family Field Programmable Gate Array (FPGA) in a 672-ball BGA package offering 8,320 logic elements and 106,496 bits of embedded RAM. It implements the APEX MultiCore architecture that integrates LUT-based logic, product-term logic, and embedded memory blocks for mixed register- and memory-intensive functions.

Designed for industrial-grade applications, this surface-mount FPGA delivers a balance of logic density, on-chip memory and flexible I/O suitable for embedded systems, industrial control, communications interfaces and other applications that require moderate gate count with multivoltage I/O support and robust operating-range specifications.

Key Features

  • Core Architecture MultiCore architecture combining look-up table (LUT) logic, product-term logic and embedded system blocks for implementing register-intensive and combinatorial functions.
  • Logic Capacity 8,320 logic elements (equivalent to approximately 526,000 maximum system gates as defined for the EP20K200 family).
  • Embedded Memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM for FIFOs, dual-port RAM and other memory functions.
  • I/O and Interface Flexibility 376 user I/O pins with MultiVolt I/O interface support as documented for the APEX 20K family, enabling interoperability with multiple external I/O voltage domains.
  • Clock and Timing Family-level clock management features include multiple phase-locked loops (PLLs), global clock signals and a low-skew clock tree to support complex timing domains.
  • Power and Supply Internal supply support around 1.8 V (product supply listed as 1.71 V to 1.89 V) and family-level options for low-power operation and programmable power-saving modes.
  • Package and Mounting 672-ball BBGA (supplier package: 672-FBGA 27×27) surface-mount package for compact board-level integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as Industrial grade for deployment in demanding environments.
  • Standards and Advanced I/O Family datasheet documents support for high-speed I/O standards and features such as LVDS and support for external memory interfaces (as described for the APEX 20K family).
  • Compliance RoHS status: Compliant.

Typical Applications

  • Industrial Control Motor control, PLC interfaces and factory automation functions that benefit from the device’s industrial temperature rating and on-chip memory for buffering and control logic.
  • Embedded Systems System-on-programmable-chip roles where integrated LUT logic and embedded RAM implement control, timing and data-path functions.
  • Communications and Interface Bridging Protocol bridging, I/O translation and buffering tasks that leverage the device’s flexible I/O capabilities and on-chip memory.
  • Instrumentation and Test Data acquisition front-ends and signal conditioning logic that require deterministic logic resources and on-chip FIFOs or dual-port RAM.

Unique Advantages

  • Integrated MultiCore Architecture: Combines LUT logic, product-term logic and embedded system blocks to simplify implementation of mixed register- and memory-centric functions.
  • Balanced Logic and Memory: 8,320 logic elements paired with approximately 0.106 Mbits of embedded RAM supports moderate-complexity designs without external memory for many buffering and control tasks.
  • Flexible I/O Options: 376 user I/O pins with family-level multivoltage I/O support enable interfacing across multiple voltage domains and system peripherals.
  • Industrial Reliability: Industrial-grade operating range (−40 °C to 100 °C) and surface-mount BGA packaging suitable for long-term deployments in demanding environments.
  • Compact Board Integration: 672-ball BGA (27×27 supplier package) provides a compact footprint for space-constrained PCBs while maintaining extensive I/O and logic resources.
  • Standards-Oriented I/O: Family-level support for high-speed signaling and common memory interfaces helps accelerate integration with external subsystems.

Why Choose EP20K200EFI672-2X?

The EP20K200EFI672-2X delivers a practical mix of logic density, embedded memory and flexible I/O in a compact 672-BBGA package from Intel’s APEX 20K family. Its MultiCore architecture and family-level clock-management features enable implementations that require both register-intensive and memory-centric functions, while the industrial temperature rating supports deployment in harsh environments.

This device is well suited for engineering teams building industrial controllers, embedded systems and communications interfaces that need a proven programmable-logic platform with on-chip RAM, ample I/O and multivoltage interfacing options.

Request a quote or submit a pricing inquiry to evaluate EP20K200EFI672-2X for your next design project.

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