EP20K200EFC672-2

IC FPGA 376 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 672-BBGA

Quantity 427 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC672-2 – APEX-20KE Field Programmable Gate Array, 672-BBGA

The EP20K200EFC672-2 is an APEX-20KE family Field Programmable Gate Array (FPGA) in a 672-ball BGA package. It uses the APEX 20K MultiCore architecture integrating look‑up table (LUT) logic, product‑term logic, and embedded memory to support system-on-a-programmable-chip designs.

Designed for commercial applications, the device provides a balance of logic density, embedded RAM, and I/O capability suitable for designs requiring programmable logic, on‑chip memory, and flexible I/O interfacing within a 0 °C to 85 °C operating range.

Key Features

  • Core Architecture  APEX 20K MultiCore architecture with LUT and product‑term logic for register‑ and combinatorial‑intensive functions.
  • Logic Capacity  Approximately 8,320 logic elements and up to 526,000 system gates to implement complex custom logic functions.
  • Embedded Memory  Approximately 106,496 bits of on‑chip RAM for FIFOs, dual‑port RAM, or other memory‑based functions.
  • I/O and Interfaces  376 user I/O pins with MultiVolt I/O support and programmable I/O features documented for the APEX 20K family.
  • Clock Management  Family features include multiple PLLs, a low‑skew clock tree and multiple global clocks for flexible clock distribution and timing control.
  • Power and Supply  Internal/core supply range listed at 1.71 V to 1.89 V; designed for low‑power operation with family power‑saving options.
  • Package and Mounting  672‑ball BGA package (supplier device package: 672‑FBGA, 27 × 27) for compact surface‑mount integration.
  • Temperature and Grade  Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant for environmental regulatory requirements.

Typical Applications

  • High‑speed memory controllers  On‑chip RAM and APEX family support for external memory interfaces make the device suitable for custom DDR/fast SRAM controller logic.
  • PCI and bus interface logic  Family‑level support for PCI Local Bus interfaces enables implementation of bus bridges and custom PCI logic.
  • Data path and packet processing  Logic density and dedicated interconnect structures support packet/frame processing, buffering, and protocol handling functions.
  • Custom digital subsystems  Use embedded memory, product‑term logic, and LUTs to implement FIFOs, CAMs, and mixed combinatorial/sequential blocks for system integration.

Unique Advantages

  • Programmable system integration: The MultiCore architecture combines LUTs, product‑term logic, and embedded memory for compact SOPC‑style integration of custom functions.
  • Balanced capacity: With about 8,320 logic elements and roughly 106,496 bits of embedded RAM, the device supports substantial logic plus on‑chip memory without reducing available logic resources.
  • Flexible I/O support: 376 user I/O pins and documented MultiVolt I/O interface options facilitate interfacing across multiple voltage domains common in mixed‑signal systems.
  • Clocking flexibility: Multiple PLLs, a low‑skew clock tree and several global clock signals provide options for sophisticated clock management and timing control.
  • Compact BGA package: 672‑ball BGA (27 × 27) enables a high I/O count and dense integration in space‑constrained board designs.
  • RoHS compliant: Meets RoHS requirements for environmentally conscious design and manufacturing.

Why Choose EP20K200EFC672-2?

The EP20K200EFC672-2 offers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 672‑ball BGA package. It is positioned for commercial embedded and system designs that require programmable integration of custom logic, buffering, and interface functions within the APEX‑20K family architecture.

Engineers selecting this device benefit from the family’s MultiCore architecture and on‑chip memory capacity, giving a clear path to consolidate discrete logic and memory into a single programmable device while maintaining flexible clock and I/O options.

Request a quote or submit an inquiry for pricing and availability to include the EP20K200EFC672-2 in your next design evaluation.

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