EP20K200EFC672-1

The EP20K200EFC672-1 is an Intel APEX-20KE series FPGA in a 672-ball BGA package designed for commercial-grade system integration. Built on the APEX MultiCore architecture, the device combines look-up table (LUT) logic, product-term logic and embedded memory blocks to address applications that require dense logic, embedded RAM and flexible I/O.

With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 376 user I/O pins, this device targets designs needing substantial logic capacity, on-chip memory and broad I/O support while operating from a low internal supply range.

Key Features

• Core Architecture MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for register‑intensive and combinatorial functions.
• Logic Capacity 8,320 logic elements and up to 526,000 system gates provide room for complex glue logic, state machines and custom processing engines.
• Embedded Memory Approximately 0.106 Mbits of on-chip RAM (106,496 bits) implemented as ESBs suitable for FIFOs, dual-port RAM and CAM functions.
• I/O and Interface Support 376 user I/O pins with MultiVolt™ I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling options and support for high-speed interfaces such as LVDS, PCI and DDR memory interconnects referenced in the device family documentation.
• Clocking and Timing Flexible clock management including up to four PLLs, a built-in low‑skew clock tree, up to eight global clock signals and programmable clock features (ClockLock, ClockBoost, ClockShift) for refined timing control.
• Power and I/O Control Designed for low-power operation with an internal supply voltage in the 1.71 V to 1.89 V range and programmable I/O slew-rate and clamp options to help manage switching noise and interface levels.
• Package and Mounting 672-BBGA package (supplier package: 672-FBGA, 27 × 27 mm) optimized for surface-mount assembly in space-constrained PCB layouts.
• Commercial Temperature Grade Rated for commercial operation from 0 °C to 85 °C.
• Standards and Compliance RoHS-compliant material status.

Typical Applications

• Memory Interface Controllers Implement DDR SDRAM and ZBT SRAM interfaces using the device’s high-speed I/O and ESB-based memory structures for buffering and protocol handling.
• High-speed Peripheral Bridging Bridge and translate between industry bus standards (for example PCI-level signaling scenarios documented for this device family) and custom logic domains.
• Custom Logic and Glue Replace legacy ASIC or discrete logic with reprogrammable logic for state machines, protocol offload and interface arbitration using 8,320 logic elements and plentiful I/O.
• Data Path and DSP Support Implement packet processing, serialization/deserialization, and medium-complexity datapath functions leveraging dedicated interconnect and product-term logic.

Unique Advantages

• MultiCore integration: Combines LUTs, product-term logic and embedded memory to consolidate multiple system functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 0.106 Mbits of embedded RAM lets you implement FIFOs, buffers and small on-chip data stores without consuming logic resources.
• Flexible I/O voltages: MultiVolt I/O support simplifies interfacing to a wide range of legacy and modern signaling standards on the same board.
• Advanced clock management: Up to four PLLs, multiple global clocks and programmable clock features enable tight timing control for complex synchronous designs.
• Commercial-grade thermal range: Rated 0 °C to 85 °C for use in typical commercial embedded and communications equipment.
• Compact BGA packaging: 672-ball FBGA package provides high pin count in a compact 27 × 27 mm footprint for dense PCB designs.

Why Choose EP20K200EFC672-1?

The EP20K200EFC672-1 offers a balanced combination of logic density, on-chip memory and flexible I/O suitable for complex commercial embedded designs. Its MultiCore architecture and robust clocking features make it a practical choice for engineers consolidating multiple functions—memory interfaces, bus bridging and custom datapath logic—into a single programmable device.

For developers targeting compact, surface-mount solutions, the 672-BBGA package and comprehensive feature set provide scalability and integration while adhering to commercial operating conditions and RoHS compliance backed by Intel’s APEX 20K family documentation.

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