EP20K200EFC672-1X

IC FPGA 376 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 672-BBGA

Quantity 784 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC672-1X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 672-BBGA

The EP20K200EFC672-1X is an Altera APEX-20KE family FPGA in a 672-ball FBGA package designed for commercial embedded logic applications. It implements a MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) to integrate logic and memory on a single device.

With 8,320 logic elements, approximately 0.11 Mbits of embedded memory, and 376 user I/O pins, this device targets system-on-a-programmable-chip designs that require dense logic, embedded RAM, and flexible I/O in a compact surface-mount package.

Key Features

  • Core architecture  MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions.
  • Logic resources  8,320 logic elements (LEs) and up to 526,000 system gates provide substantial on-chip logic capacity for mid-range designs.
  • Embedded memory  106,496 total RAM bits (approximately 0.11 Mbits) implemented in embedded system blocks (ESBs) for FIFOs, dual-port RAM, and CAM-style functions.
  • I/O and interfacing  376 user I/O pins in the 672-BBGA package enable multi-device interfacing and high-pin-count connectivity.
  • Clock and timing features  Family data highlights flexible clock management including multiple PLLs, a low-skew clock tree, and global clock signals to support complex timing domains.
  • Package and mounting  672-ball FBGA (27 × 27 mm) surface-mount package for compact board integration.
  • Power and supply  Internal supply and I/O support per family guidance, with this device specifying a voltage supply range of 1.71 V to 1.89 V for core operation.
  • Operating range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Embedded systems  Implement system-on-a-programmable-chip (SOPC) architectures where integrated logic and embedded memory reduce board-level components.
  • Data buffering and memory control  ESB-based RAM is suitable for FIFOs and dual-port memory functions in designs requiring on-chip buffering and memory control.
  • High-density digital logic  Mid-range logic integration such as protocol bridging, glue logic, and custom digital datapaths using 8,320 logic elements.
  • Interface and I/O handling  A 376-pin I/O count supports multi-signal interfaces and high-pin-count connectivity in compact packages.

Unique Advantages

  • Integrated memory and logic: ESBs provide embedded RAM and product-term implementation options, reducing external memory requirements and simplifying designs.
  • Substantial mid-range capacity: 8,320 logic elements and 526,000 gates deliver balanced capacity for control, data-path, and interfacing tasks without excessive board BOM.
  • Flexible I/O count: 376 user I/O pins in a 672-FBGA package enable dense connectivity for multi-channel or multi-interface applications.
  • Commercial-grade thermal profile: Rated for 0 °C to 85 °C operation to match typical commercial electronic equipment environments.
  • RoHS compliant: Meets RoHS requirements for lead-free manufacturing and regulatory compliance in commercial products.

Why Choose EP20K200EFC672-1X?

The EP20K200EFC672-1X combines APEX-20KE family architectural features—LUT and product-term logic plus embedded system blocks—with a mid-range logic density of 8,320 logic elements and roughly 0.11 Mbits of on-chip RAM. Its 376 I/O pins and 672-FBGA footprint make it well suited to compact, board-level designs that require integrated memory, flexible interfacing, and robust clock management capabilities.

This commercial-grade FPGA is appropriate for developers building SOPC-style embedded solutions, data buffering subsystems, or multi-interface digital controllers who need a balance of logic capacity, embedded RAM, and I/O in a single surface-mount device with vendor-backed documentation.

If you would like pricing, lead-time details, or to request a formal quote for EP20K200EFC672-1X, submit a request or contact sales with your part quantity and delivery requirements.

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