EP20K200EFC672-1N
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 672-BBGA |
|---|---|
| Quantity | 65 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFC672-1N – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 672-BBGA
The EP20K200EFC672-1N is an Altera APEX-20KE® family field programmable gate array supplied in a 672-BBGA package. It provides a mid-density programmable logic solution combining 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 376 user I/O pins for versatile digital design integration.
Targeted at commercial applications, this surface-mount FPGA operates from a 1.71 V to 1.89 V core supply and supports an ambient temperature range of 0 °C to 85 °C, offering a balance of integration, I/O capacity, and package density for prototyping and production designs.
Key Features
- Core Logic — 8,320 logic elements and a total gate equivalent of 526,000 provide programmable combinational and sequential resources for custom logic implementations.
- Embedded Memory — Total on-chip RAM of 106,496 bits (approximately 0.106 Mbits) for data buffering, FIFOs, and small memory structures directly in the fabric.
- I/O Capability — 376 user I/O pins to support a broad set of external interfaces and parallel connectivity in a compact footprint.
- Package and Mounting — 672-BBGA (supplier device package: 672-FBGA, 27 × 27 mm) in a surface-mount form factor for high-density board layouts.
- Power — Core voltage supply range of 1.71 V to 1.89 V to match system power rails and support consistent core performance.
- Environmental and Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C; RoHS-compliant for regulatory and environmental requirements.
Typical Applications
- Consumer Electronics — Implement custom control logic, peripheral bridging, and glue logic for consumer devices where compact packaging and flexible I/O are required.
- Communications Equipment — Use the FPGA’s I/O density and programmable logic to implement protocol interfaces, packet processing blocks, or custom timing functions in commercial communications gear.
- Prototyping and Development — Suitable for hardware prototypes and design validation where reprogrammable logic and embedded memory speed iteration cycles.
- Commercial Control Systems — Deploy in control and automation equipment for commercial environments that operate within the device’s specified temperature range.
Unique Advantages
- High Logic Density — 8,320 logic elements give designers room to implement complex state machines, custom processing blocks, and glue logic without external ASIC development.
- On‑chip Memory for Data Handling — Approximately 0.106 Mbits of embedded RAM enables local buffering and small data structures, reducing external memory dependence.
- Large I/O Count — 376 user I/O pins simplify interfacing to multiple peripherals, parallel buses, and board-level signals in a single device.
- Compact, Surface‑Mount Package — 672-BBGA (27 × 27 mm) package allows high-density PCB designs while maintaining robust mechanical mounting.
- Designed for Commercial Systems — Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
- Tight Core Voltage Range — Defined 1.71 V to 1.89 V supply window supports consistent power design and system integration.
Why Choose EP20K200EFC672-1N?
The EP20K200EFC672-1N provides a compact, mid-density FPGA option for commercial designs that need substantial logic resources, generous I/O, and on-chip memory in a 672-BBGA surface-mount package. Its combination of 8,320 logic elements, 376 I/O pins, and approximately 0.106 Mbits of embedded RAM makes it well-suited to applications where board space, reprogrammability, and interface flexibility are important.
Designed and supplied as a commercial-grade, RoHS-compliant device with a defined core voltage range and operating temperature window, this APEX-20KE® FPGA is appropriate for teams focusing on rapid development, board-level integration, and scalable logic implementations with predictable supply and environmental characteristics.
Request a quote or submit a pricing inquiry to evaluate EP20K200EFC672-1N for your next design project.

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