EP20K200EFC672-3

The EP20K200EFC672-3 is an APEX-20KE family FPGA in a 672-ball BGA package (27 × 27 mm) providing a balanced mix of logic, embedded memory, and flexible I/O for commercial applications. It implements the APEX MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to support register-intensive and memory-intensive functions within a single programmable device.

Designed for applications requiring mid-density programmable logic, on-chip memory, and versatile I/O signaling, this device targets system integration tasks such as interface bridging, memory controller logic, and custom accelerator functions while operating within commercial temperature and power envelopes.

Key Features

• Logic Capacity — 8,320 logic elements (LEs) and approximately 526,000 system gates provide a mid-range programmable fabric for custom logic and control functions.
• Embedded Memory — Approximately 0.106 Mbits of on-chip RAM (106,496 bits) implemented in ESBs for FIFOs, dual-port RAM, and content-addressable memory (CAM) usage models.
• I/O and Pin Count — 376 user I/O pins support a broad set of external interfaces and signalling options for system-level integration.
• Package & Mounting — 672-ball BGA (27 × 27 mm) surface-mount package suitable for compact board layouts.
• Power Supply & Operating Range — Internal supply behavior supported around 1.8 V with a specified voltage-supply window of 1.71 V to 1.89 V and a commercial operating temperature range of 0 °C to 85 °C.
• Clocking & PLLs — Family-level features include flexible clock management with up to four PLLs, low-skew clock tree, and multiple global clock signals for synchronous designs.
• Advanced I/O Capabilities — MultiVolt I/O support and compatibility with a range of I/O standards, plus family-level support for high-speed memory interfaces and LVDS channels.
• Embedded Architecture — MultiCore architecture combining LUT logic, product-term logic, and embedded memory to implement both combinatorial and register-intensive functions within the same device.
• Standards and Interfaces (Family) — APEX 20K family data sheet documents support for PCI (3.3 V) and high-speed external memories such as DDR SDRAM and ZBT SRAM for system interconnects.
• Compliance — RoHS-compliant for environmental requirements.

Typical Applications

• Interface Bridging and Bus Logic — Implement custom PCI or peripheral interfaces and glue logic for mid-density systems requiring configurable I/O.
• Memory Controllers — Implement DDR SDRAM or SRAM controller logic and buffering using embedded RAM and ESBs for efficient data flow and FIFO buffering.
• Signal Processing & I/O Aggregation — Aggregate and condition multiple LVDS or high-speed channels and implement protocol translation with programmable logic and dedicated clocking resources.
• Custom System Integration — Consolidate glue logic, control state machines, and embedded memory structures to reduce BOM and simplify board-level designs.

Unique Advantages

• Balanced Mid-Range Capacity: Delivers 8,320 LEs and ~526,000 gates for designs that need substantive logic without moving to higher-density devices.
• Embedded Memory Integration: Approximately 0.106 Mbits of on-chip RAM in ESBs enables FIFO, dual-port RAM, and CAM implementations without external memory for many use cases.
• Flexible Clocking: Multiple PLLs and a low-skew clock tree reduce design complexity for multi-clock systems and synchronous data paths.
• Versatile I/O Support: 376 user I/Os plus MultiVolt interface options let you interface directly with a wide range of external devices and memory technologies.
• Compact BGA Packaging: 672-ball BGA (27 × 27 mm) simplifies routing for dense boards while maintaining a surface-mount form factor.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match general-purpose and consumer-facing electronic products.

Why Choose EP20K200EFC672-3?

The EP20K200EFC672-3 positions itself as a pragmatic mid-density FPGA choice when you need a combination of logic, embedded memory, and flexible I/O in a compact BGA package. Its APEX MultiCore architecture and on-chip ESBs deliver configurable memory and combinatorial resources that simplify implementation of FIFO buffers, memory controllers, and register-heavy logic blocks.

This device is well suited for design teams building commercial products that require programmable system integration, moderate logic capacity, and support for high-bandwidth external memory interfaces. The combination of 8,320 logic elements, substantial embedded RAM, and family-level clocking and I/O features provides a scalable, vendor-supported platform for medium-complexity FPGA designs.

Request a quote or submit a pricing inquiry to evaluate EP20K200EFC672-3 for your design and receive configuration and availability information.