EP20K200EFI484-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 593 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFI484-3 – APEX-20KE® FPGA, 8,320 logic elements, ~106,496-bit RAM, 376 I/Os, 484-BBGA
The EP20K200EFI484-3 is an Intel APEX-20KE® field programmable gate array (FPGA) packaged in a 484-ball BGA. It implements the APEX 20K MultiCore architecture combining lookup-table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for on-chip memory and logic functions. This device targets applications requiring dense logic, flexible I/O, and embedded memory integration for system-level designs.
Key Features
- Core Architecture APEX MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
- Logic Capacity 8,320 logic elements (LEs) providing up to 526,000 maximum system gates for medium-density programmable logic designs.
- Embedded Memory Approximately 106,496 bits of on-chip RAM supported by ESBs that can implement FIFOs, dual-port RAM, and CAM functions.
- I/O and Interface Flexibility 376 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling and advanced I/O standards support (LVDS, PCI at 3.3 V, etc.).
- Clock Management Flexible clock resources including up to four PLLs, a built-in low-skew clock tree, and features such as ClockLock, ClockBoost, and programmable phase/delay shifting.
- Power Designed for low-power operation with an internal supply voltage range of approximately 1.71 V to 1.89 V and ESB power-saving modes.
- Package and Mounting Surface-mount 484-BBGA package (supplier device package: 484-FBGA, 23×23) suitable for compact board layouts.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployments in industrial environments.
- Standards and Memory Support I/O capable of supporting high-speed external memories and standards such as DDR SDRAM and PCI (3.3 V, 33/66 MHz) where applicable.
Typical Applications
- Communications Infrastructure — Implement protocol bridges, packet processing, and high-speed I/O aggregation leveraging LVDS and multi-voltage I/O support.
- Embedded Systems & SOPC — Integrate custom logic and embedded memory blocks for system-on-a-programmable-chip designs that require on-chip FIFOs and dual-port RAM.
- Memory Interface and Buffering — Implement memory controllers, DDR interfaces, and buffering logic using the device’s ESBs and flexible I/O.
- Industrial Control — Build control logic, real-time processing, and I/O interfacing for industrial equipment within an extended temperature range.
Unique Advantages
- Highly integrated MultiCore architecture: Combines LUTs, product-term logic, and ESBs to consolidate logic and memory functions on-chip, reducing external components.
- Significant on-chip memory: Approximately 106,496 bits of embedded RAM enable implementation of FIFOs, dual-port RAM, and CAM without reducing available logic.
- Flexible, high-density I/O: 376 user I/Os with MultiVolt support and advanced I/O standards allow broad interfacing options with external devices and memory.
- Robust clocking features: Multiple PLLs, low-skew clock tree, and programmable clock-shifting features simplify complex timing and clock distribution tasks.
- Industrial temperature capability: Operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
- Compact surface-mount package: 484-BBGA (484-FBGA 23×23) enables high-density board designs while maintaining substantial I/O and logic resources.
Why Choose EP20K200EFI484-3?
The EP20K200EFI484-3 offers a balanced combination of logic density, embedded memory, and flexible I/O in a compact 484-ball BGA package. Its APEX MultiCore architecture and ESB-based memory features make it well-suited for system-level FPGA roles where on-chip RAM, FIFO implementation, and programmable logic must coexist. The device’s clock management and I/O capabilities support designs that require precise timing and diverse interfacing options, while the industrial temperature rating broadens usable deployment environments.
This part is a practical choice for engineers building embedded systems, communications modules, memory interface logic, or industrial control solutions that require integrated memory and versatile I/O driven by a mid-range logic element count.
Request a quote or submit an inquiry to check availability and pricing for EP20K200EFI484-3 and to discuss how it can fit into your next design.

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