EP20K200EFI484-3

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 593 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFI484-3 – APEX-20KE® FPGA, 8,320 logic elements, ~106,496-bit RAM, 376 I/Os, 484-BBGA

The EP20K200EFI484-3 is an Intel APEX-20KE® field programmable gate array (FPGA) packaged in a 484-ball BGA. It implements the APEX 20K MultiCore architecture combining lookup-table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for on-chip memory and logic functions. This device targets applications requiring dense logic, flexible I/O, and embedded memory integration for system-level designs.

Key Features

  • Core Architecture APEX MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
  • Logic Capacity 8,320 logic elements (LEs) providing up to 526,000 maximum system gates for medium-density programmable logic designs.
  • Embedded Memory Approximately 106,496 bits of on-chip RAM supported by ESBs that can implement FIFOs, dual-port RAM, and CAM functions.
  • I/O and Interface Flexibility 376 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling and advanced I/O standards support (LVDS, PCI at 3.3 V, etc.).
  • Clock Management Flexible clock resources including up to four PLLs, a built-in low-skew clock tree, and features such as ClockLock, ClockBoost, and programmable phase/delay shifting.
  • Power Designed for low-power operation with an internal supply voltage range of approximately 1.71 V to 1.89 V and ESB power-saving modes.
  • Package and Mounting Surface-mount 484-BBGA package (supplier device package: 484-FBGA, 23×23) suitable for compact board layouts.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployments in industrial environments.
  • Standards and Memory Support I/O capable of supporting high-speed external memories and standards such as DDR SDRAM and PCI (3.3 V, 33/66 MHz) where applicable.

Typical Applications

  • Communications Infrastructure — Implement protocol bridges, packet processing, and high-speed I/O aggregation leveraging LVDS and multi-voltage I/O support.
  • Embedded Systems & SOPC — Integrate custom logic and embedded memory blocks for system-on-a-programmable-chip designs that require on-chip FIFOs and dual-port RAM.
  • Memory Interface and Buffering — Implement memory controllers, DDR interfaces, and buffering logic using the device’s ESBs and flexible I/O.
  • Industrial Control — Build control logic, real-time processing, and I/O interfacing for industrial equipment within an extended temperature range.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUTs, product-term logic, and ESBs to consolidate logic and memory functions on-chip, reducing external components.
  • Significant on-chip memory: Approximately 106,496 bits of embedded RAM enable implementation of FIFOs, dual-port RAM, and CAM without reducing available logic.
  • Flexible, high-density I/O: 376 user I/Os with MultiVolt support and advanced I/O standards allow broad interfacing options with external devices and memory.
  • Robust clocking features: Multiple PLLs, low-skew clock tree, and programmable clock-shifting features simplify complex timing and clock distribution tasks.
  • Industrial temperature capability: Operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
  • Compact surface-mount package: 484-BBGA (484-FBGA 23×23) enables high-density board designs while maintaining substantial I/O and logic resources.

Why Choose EP20K200EFI484-3?

The EP20K200EFI484-3 offers a balanced combination of logic density, embedded memory, and flexible I/O in a compact 484-ball BGA package. Its APEX MultiCore architecture and ESB-based memory features make it well-suited for system-level FPGA roles where on-chip RAM, FIFO implementation, and programmable logic must coexist. The device’s clock management and I/O capabilities support designs that require precise timing and diverse interfacing options, while the industrial temperature rating broadens usable deployment environments.

This part is a practical choice for engineers building embedded systems, communications modules, memory interface logic, or industrial control solutions that require integrated memory and versatile I/O driven by a mid-range logic element count.

Request a quote or submit an inquiry to check availability and pricing for EP20K200EFI484-3 and to discuss how it can fit into your next design.

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