EP20K200EFI484-2X

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 1,069 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFI484-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

The EP20K200EFI484-2X is an APEX‑20KE series field programmable gate array (FPGA) supplied in a 484‑BBGA (484‑FBGA, 23×23) surface‑mount package. It implements a MultiCore architecture that combines LUT logic, product‑term logic and embedded memory to support integrated, register‑ and memory‑intensive designs.

Designed for industrial applications, the device provides a balance of logic density, embedded memory and flexible I/O for system integration where on‑chip resources, configurable interfaces and extended temperature range matter.

Key Features

  • Core Logic Approximately 8,320 logic elements and up to 526,000 system gates provide significant on‑chip logic capacity for custom digital functions.
  • Embedded Memory Approximately 0.106 Mbits of embedded memory (106,496 bits) and 52 embedded system blocks (ESBs) for FIFO, dual‑port RAM and content‑addressable memory implementations.
  • Macrocells Up to 832 macrocells for product‑term based combinatorial functions and microcell implementations.
  • I/O and Interface Flexibility 376 user I/O pins with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V and 5.0 V) to interface with a wide range of external devices and memory types.
  • Clocking and Timing Series‑level clock management includes multiple PLLs, a low‑skew clock tree and features for programmable clock phase and delay control for precise timing.
  • Package and Mounting 484‑BBGA (484‑FBGA, 23×23) surface‑mount package suitable for compact board designs requiring a high I/O count in a ball grid array format.
  • Power and Temperature Internal supply voltage specified in the range 1.71 V to 1.89 V and an operating temperature range from −40 °C to 100 °C for industrial environments.
  • Compliance RoHS‑compliant manufacturing.

Typical Applications

  • High‑performance memory interfaces — Use the device where on‑chip logic must directly interface with external memories (DDR SDRAM, ZBT SRAM) leveraging the FPGA’s embedded memory and I/O capabilities.
  • System integration and SOPC designs — Implement embedded system blocks, FIFOs and custom logic cores in a single programmable device to reduce component count and simplify board design.
  • Industrial control and automation — Deploy in industrial applications that require extended temperature operation and flexible voltage interfacing for diverse peripheral standards.
  • High‑speed serial and parallel I/O — Leverage LVDS and other supported I/O standards for medium‑to‑high bandwidth channel implementations and peripheral connectivity.

Unique Advantages

  • High logic and gate density: 8,320 logic elements and up to 526,000 gates enable complex logic implementation without immediate need for external devices.
  • Embedded memory capacity: Approximately 0.106 Mbits of on‑chip RAM plus ESBs support buffering, FIFOs and dual‑port RAM functions directly on the FPGA.
  • Flexible I/O voltage support: MultiVolt I/O levels (1.8 V–5.0 V) make it easier to interface with mixed‑voltage systems and legacy peripherals.
  • Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
  • Compact, high‑I/O package: 484‑BBGA (23×23) provides a high pin count in a compact footprint, enabling dense board layouts.
  • RoHS compliant: Manufactured to RoHS standards for regulatory compliance in lead‑free assemblies.

Why Choose EP20K200EFI484-2X?

The EP20K200EFI484-2X delivers a balanced combination of logic density, embedded memory and flexible I/O in an industrial‑grade FPGA package. Its MultiCore architecture and series‑level clock and I/O features support integrated system designs that consolidate logic, memory and high‑speed interfaces on a single device.

This part is well suited for engineering teams developing industrial control, memory‑interface, and system‑level FPGA solutions that require extended temperature operation, mixed‑voltage interfacing and a compact high‑I/O package. Its feature set enables reduced BOM and simplified board design while maintaining the configurability expected from the APEX‑20K family.

Request a quote or submit an inquiry to check pricing and availability for the EP20K200EFI484-2X and to discuss how it can fit into your next design.

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