EP20K200EFI484-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 1,069 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFI484-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA
The EP20K200EFI484-2X is an APEX‑20KE series field programmable gate array (FPGA) supplied in a 484‑BBGA (484‑FBGA, 23×23) surface‑mount package. It implements a MultiCore architecture that combines LUT logic, product‑term logic and embedded memory to support integrated, register‑ and memory‑intensive designs.
Designed for industrial applications, the device provides a balance of logic density, embedded memory and flexible I/O for system integration where on‑chip resources, configurable interfaces and extended temperature range matter.
Key Features
- Core Logic Approximately 8,320 logic elements and up to 526,000 system gates provide significant on‑chip logic capacity for custom digital functions.
- Embedded Memory Approximately 0.106 Mbits of embedded memory (106,496 bits) and 52 embedded system blocks (ESBs) for FIFO, dual‑port RAM and content‑addressable memory implementations.
- Macrocells Up to 832 macrocells for product‑term based combinatorial functions and microcell implementations.
- I/O and Interface Flexibility 376 user I/O pins with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V and 5.0 V) to interface with a wide range of external devices and memory types.
- Clocking and Timing Series‑level clock management includes multiple PLLs, a low‑skew clock tree and features for programmable clock phase and delay control for precise timing.
- Package and Mounting 484‑BBGA (484‑FBGA, 23×23) surface‑mount package suitable for compact board designs requiring a high I/O count in a ball grid array format.
- Power and Temperature Internal supply voltage specified in the range 1.71 V to 1.89 V and an operating temperature range from −40 °C to 100 °C for industrial environments.
- Compliance RoHS‑compliant manufacturing.
Typical Applications
- High‑performance memory interfaces — Use the device where on‑chip logic must directly interface with external memories (DDR SDRAM, ZBT SRAM) leveraging the FPGA’s embedded memory and I/O capabilities.
- System integration and SOPC designs — Implement embedded system blocks, FIFOs and custom logic cores in a single programmable device to reduce component count and simplify board design.
- Industrial control and automation — Deploy in industrial applications that require extended temperature operation and flexible voltage interfacing for diverse peripheral standards.
- High‑speed serial and parallel I/O — Leverage LVDS and other supported I/O standards for medium‑to‑high bandwidth channel implementations and peripheral connectivity.
Unique Advantages
- High logic and gate density: 8,320 logic elements and up to 526,000 gates enable complex logic implementation without immediate need for external devices.
- Embedded memory capacity: Approximately 0.106 Mbits of on‑chip RAM plus ESBs support buffering, FIFOs and dual‑port RAM functions directly on the FPGA.
- Flexible I/O voltage support: MultiVolt I/O levels (1.8 V–5.0 V) make it easier to interface with mixed‑voltage systems and legacy peripherals.
- Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
- Compact, high‑I/O package: 484‑BBGA (23×23) provides a high pin count in a compact footprint, enabling dense board layouts.
- RoHS compliant: Manufactured to RoHS standards for regulatory compliance in lead‑free assemblies.
Why Choose EP20K200EFI484-2X?
The EP20K200EFI484-2X delivers a balanced combination of logic density, embedded memory and flexible I/O in an industrial‑grade FPGA package. Its MultiCore architecture and series‑level clock and I/O features support integrated system designs that consolidate logic, memory and high‑speed interfaces on a single device.
This part is well suited for engineering teams developing industrial control, memory‑interface, and system‑level FPGA solutions that require extended temperature operation, mixed‑voltage interfacing and a compact high‑I/O package. Its feature set enables reduced BOM and simplified board design while maintaining the configurability expected from the APEX‑20K family.
Request a quote or submit an inquiry to check pricing and availability for the EP20K200EFI484-2X and to discuss how it can fit into your next design.

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