EP20K200EFC484-3

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 528 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC484-3 – APEX-20KE Field Programmable Gate Array (FPGA) 484-BBGA

The EP20K200EFC484-3 is an APEX-20KE series FPGA IC delivering a balanced mix of logic capacity, embedded memory and flexible I/O in a 484-ball BGA package. It implements the APEX MultiCore architecture with LUT-based logic and embedded system blocks (ESBs), enabling system-on-programmable-chip (SOPC) integration for embedded and communications-oriented designs.

With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 376 user I/O pins, this device targets applications that require moderate gate counts, dense I/O and multi‑voltage I/O interfacing while operating from a 1.71 V–1.89 V core supply in commercial temperature environments.

Key Features

  • Core & Architecture  APEX MultiCore architecture integrating LUT logic and embedded system blocks (ESBs) for a blend of register-intensive and memory/combinatorial functions.
  • Logic Capacity  8,320 logic elements and up to 526,000 system gates provide room for medium-density programmable logic implementations.
  • Embedded Memory  Approximately 0.106 Mbits of on-chip RAM supported by ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) functions.
  • I/O & Interfaces  376 user I/O pins with MultiVolt I/O support (series-level support for 1.8 V, 2.5 V, 3.3 V and 5.0 V levels) and programmable I/O features for flexible interfacing.
  • Clock Management  Series-level clock features include multiple PLLs, a low-skew clock tree and support for multiple global clock signals to simplify system timing.
  • Power & Compliance  Core supply specified at 1.71 V to 1.89 V, designed for low-power operation; RoHS compliant.
  • Package & Mounting  484-ball BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.

Typical Applications

  • Embedded Systems  Implement control logic, peripheral interfaces and SOPC-style integration where combined logic and embedded memory reduce external component count.
  • Communications & Networking  Use the device’s flexible I/O and clock management for protocol bridging, packet handling and medium-density data-path functions.
  • Memory Interface & Buffering  Leverage ESB-based RAM and FIFO structures for buffering and interfacing with external memory and streaming data sources.
  • Prototyping & System Integration  Ideal for development of medium-complexity programmable functions in desktop and rack-mounted prototypes where surface-mount BGA integration is required.

Unique Advantages

  • Balanced Logic and Memory:  8,320 logic elements combined with embedded RAM allow mixed logic-plus-memory designs without heavy reliance on external memory.
  • Flexible I/O Options:  376 user I/Os and series-level MultiVolt support enable direct interfacing to a wide range of peripheral voltages and signaling standards.
  • Integrated Clock Management:  Multiple PLLs and a dedicated low-skew clock structure simplify clock distribution for synchronous designs.
  • Compact, Surface-Mount Package:  484-BBGA (23×23) package supports high pin density in a small board footprint for space-constrained applications.
  • RoHS Compliant:  Meets lead-free and restricted materials requirements for environmentally conscious designs.

Why Choose EP20K200EFC484-3?

The EP20K200EFC484-3 positions itself as a commercially graded, medium-density FPGA that combines APEX MultiCore architecture with embedded system blocks and flexible I/O to address embedded and communications use cases. Its mix of 8,320 logic elements, on-chip RAM and 376 I/O pins makes it suitable for designs that require integrated memory functions alongside programmable logic while maintaining a compact BGA footprint.

Choose this device when you need a manufacturer-backed FPGA offering for system integration, moderate gate-count logic and multi‑voltage I/O flexibility in commercial-temperature applications. The combination of internal supply specification, package options and series-level clock and I/O features supports scalable designs and straightforward board integration.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the EP20K200EFC484-3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up