EP20K200EFC484-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 528 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFC484-3 – APEX-20KE Field Programmable Gate Array (FPGA) 484-BBGA
The EP20K200EFC484-3 is an APEX-20KE series FPGA IC delivering a balanced mix of logic capacity, embedded memory and flexible I/O in a 484-ball BGA package. It implements the APEX MultiCore architecture with LUT-based logic and embedded system blocks (ESBs), enabling system-on-programmable-chip (SOPC) integration for embedded and communications-oriented designs.
With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 376 user I/O pins, this device targets applications that require moderate gate counts, dense I/O and multi‑voltage I/O interfacing while operating from a 1.71 V–1.89 V core supply in commercial temperature environments.
Key Features
- Core & Architecture APEX MultiCore architecture integrating LUT logic and embedded system blocks (ESBs) for a blend of register-intensive and memory/combinatorial functions.
- Logic Capacity 8,320 logic elements and up to 526,000 system gates provide room for medium-density programmable logic implementations.
- Embedded Memory Approximately 0.106 Mbits of on-chip RAM supported by ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) functions.
- I/O & Interfaces 376 user I/O pins with MultiVolt I/O support (series-level support for 1.8 V, 2.5 V, 3.3 V and 5.0 V levels) and programmable I/O features for flexible interfacing.
- Clock Management Series-level clock features include multiple PLLs, a low-skew clock tree and support for multiple global clock signals to simplify system timing.
- Power & Compliance Core supply specified at 1.71 V to 1.89 V, designed for low-power operation; RoHS compliant.
- Package & Mounting 484-ball BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
Typical Applications
- Embedded Systems Implement control logic, peripheral interfaces and SOPC-style integration where combined logic and embedded memory reduce external component count.
- Communications & Networking Use the device’s flexible I/O and clock management for protocol bridging, packet handling and medium-density data-path functions.
- Memory Interface & Buffering Leverage ESB-based RAM and FIFO structures for buffering and interfacing with external memory and streaming data sources.
- Prototyping & System Integration Ideal for development of medium-complexity programmable functions in desktop and rack-mounted prototypes where surface-mount BGA integration is required.
Unique Advantages
- Balanced Logic and Memory: 8,320 logic elements combined with embedded RAM allow mixed logic-plus-memory designs without heavy reliance on external memory.
- Flexible I/O Options: 376 user I/Os and series-level MultiVolt support enable direct interfacing to a wide range of peripheral voltages and signaling standards.
- Integrated Clock Management: Multiple PLLs and a dedicated low-skew clock structure simplify clock distribution for synchronous designs.
- Compact, Surface-Mount Package: 484-BBGA (23×23) package supports high pin density in a small board footprint for space-constrained applications.
- RoHS Compliant: Meets lead-free and restricted materials requirements for environmentally conscious designs.
Why Choose EP20K200EFC484-3?
The EP20K200EFC484-3 positions itself as a commercially graded, medium-density FPGA that combines APEX MultiCore architecture with embedded system blocks and flexible I/O to address embedded and communications use cases. Its mix of 8,320 logic elements, on-chip RAM and 376 I/O pins makes it suitable for designs that require integrated memory functions alongside programmable logic while maintaining a compact BGA footprint.
Choose this device when you need a manufacturer-backed FPGA offering for system integration, moderate gate-count logic and multi‑voltage I/O flexibility in commercial-temperature applications. The combination of internal supply specification, package options and series-level clock and I/O features supports scalable designs and straightforward board integration.
Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the EP20K200EFC484-3.

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