EP20K200EFC484-2X

The EP20K200EFC484-2X is an APEX-20KE® family FPGA optimized for designs requiring a balanced combination of logic capacity, on-chip memory, and high I/O density. Built on the APEX 20K architecture, the device integrates LUT-based logic and embedded system blocks for memory and product-term functions, making it suitable for system-on-a-programmable-chip (SOPC) integration and memory-intensive logic designs.

Key attributes include 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 376 user I/O pins in a compact 484-BBGA package, all targeted at commercial-grade applications operating from 0 °C to 85 °C with a 1.71 V to 1.89 V supply.

Key Features

• Core Architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded memory for flexible implementation of both register-intensive and combinatorial functions.
• Logic Capacity  8,320 logic elements supporting up to 526,000 system gates for mid-range FPGA designs.
• Embedded Memory  Approximately 0.106 Mbits of on-chip RAM available for FIFOs, dual-port RAM, and CAM-style implementations via embedded system blocks (ESBs).
• I/O and Interface Flexibility  376 user I/O pins with MultiVolt I/O support for interfacing with 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling levels (per APEX 20K family guidance).
• Clocking and Timing  Flexible clock management capabilities including multiple PLLs, low-skew clock tree and programmable clock phase/delay features (family-level capabilities).
• Package and Mounting  484-BBGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting for compact board designs.
• Power and Operating Range  Internal supply operation at approximately 1.8 V (specified 1.71 V to 1.89 V) and commercial temperature grade from 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant; family-level I/O features include support for standards such as LVDS and high-speed external memory interfaces (per datasheet).

Typical Applications

• Embedded Systems  Integration of control logic and embedded memory blocks for SOPC-style designs and custom system controllers.
• Memory Buffering & Interfaces  On-chip ESBs useful for FIFO and dual-port RAM implementations when interfacing to external DDR/SRAM memories.
• High-Density I/O and Protocol Bridging  Implement protocol conversion, bus interfacing, and peripheral bridging using the device’s 376 I/O pins and MultiVolt support.
• Signal Processing & Communications  Implement medium-complexity datapath and LVDS channel aggregation leveraging the dedicated interconnect and clocking features described for the APEX 20K family.

Unique Advantages

• Integrated Logic and Memory: Combine 8,320 logic elements with embedded system blocks for compact implementations of logic-plus-memory functions, reducing external component count.
• High I/O Density: 376 user I/O pins provide flexibility for complex board-level connectivity and multiple peripheral interfaces.
• MultiVolt I/O Support: Interface directly with multiple voltage domains (1.8 V–5.0 V family-level support), simplifying mixed-voltage system integration.
• Compact BBGA Package: 484-BBGA (23×23) surface-mount package enables dense PCB layouts while preserving signal access.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant to meet mainstream commercial product requirements.
• Power-Efficient Internal Supply: Low internal supply voltage (around 1.8 V) supports reduced power consumption in appropriate system designs.

Why Choose EP20K200EFC484-2X?

The EP20K200EFC484-2X positions itself as a versatile mid-range FPGA offering a balance of logic density, embedded memory, and extensive I/O in a compact 484-BBGA package. Its APEX 20K family architecture provides features for integrating LUT logic, product-term functions, and ESB-based memory that suit designs requiring on-chip data buffering, protocol handling, and SOPC-style integration.

This device is ideal for commercial-grade applications where designers need approximately 8,320 logic elements, ~0.106 Mbits of embedded RAM, and 376 I/Os with flexible voltage interfacing. The combination of on-chip resources and family-level clocking and I/O features supports scalable designs and streamlined board-level implementation.

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