EP20K200EFC484-2AB

The EP20K200EFC484-2AB is an APEX-20KE family FPGA from Intel, supplied in a 484-ball BGA package (484-BBGA). It implements a MultiCore architecture that integrates LUT-based logic, product-term logic and embedded memory, delivering a compact, programmable platform for mid- to high-density system designs.

Targeted at applications that require substantial I/O and embedded memory with flexible clocking and I/O voltage support, this device offers 8,320 logic elements, approximately 0.106 Mbits of on-chip RAM, and 376 user I/O pins in a surface-mount 23 × 23 FBGA footprint.

Key Features

• Core density – 8,320 logic elements and up to 526,000 system gates provide capacity for complex logic integration.
• Embedded memory – Approximately 106,496 bits (≈0.106 Mbits) of on-chip RAM for FIFOs, dual-port RAM and other memory functions.
• I/O and interface flexibility – 376 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling as described for the APEX 20K family.
• Clock management – Series features include up to four phase-locked loops (PLLs), a low-skew clock tree and multiple global clocks for robust timing control.
• Package and mounting – 484-BBGA (supplier package listed as 484-FBGA, 23 × 23) in a surface-mount form factor suitable for dense PCB layouts.
• Power – Internal/core supply centered around 1.8 V (device supply range 1.71 V to 1.89 V) and family-level support for power-saving ESB modes.
• Operating range and compliance – Commercial grade operation from 0 °C to 85 °C; RoHS-compliant.

Typical Applications

• Communications equipment – Use the high I/O count and clocking resources for protocol bridging, packet processing front-ends, or interface consolidation.
• Embedded controllers – Implement custom control logic and data buffering using the device’s logic elements and embedded RAM for real-time tasks.
• High-speed I/O subsystems – Leverage MultiVolt I/O and family-level LVDS and memory-interface support to interface with DDR SDRAM, ZBT SRAM and high-speed serial or parallel peripherals.
• Measurement and test systems – Apply programmable logic and flexible clock management to implement signal acquisition, pre-processing, and deterministic timing functions.

Unique Advantages

• Significant integration density: 8,320 logic elements and up to 526,000 gates reduce external logic and simplify system design.
• On-chip memory for buffering: Approximately 0.106 Mbits of embedded RAM supports FIFOs and dual-port memory architectures without external RAM.
• Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing to a wide range of system voltages, minimizing level-shifting components.
• Advanced clocking: Multiple PLLs, global clocks and programmable clock features let designers control skew and implement clock multiplication/division on-chip.
• Compact, production-ready package: Surface-mount 484-BBGA (23 × 23 FBGA) enables high-density PCB assembly with standard manufacturing processes.
• Regulatory and supply assurances: RoHS-compliant construction and commercial-grade temperature rating align with standard commercial product lifecycles.

Why Choose EP20K200EFC484-2AB?

The EP20K200EFC484-2AB offers a balanced combination of logic density, embedded memory and high I/O count in a compact 484-BBGA package, making it well suited for designers who need mid- to high-density FPGA resources without moving to larger device families. Its MultiCore architecture and family-level clocking and I/O features enable integration of register-intensive logic, memory buffering and diverse interface standards within a single FPGA.

Ideal for teams building communications, embedded control, or test-and-measurement systems, this device provides a scalable platform backed by the APEX-20K family design foundation and Intel's manufacturing pedigree, helping to simplify board-level BOM, reduce component count and accelerate time-to-market.

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