EP20K200EFC484-2
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 1,006 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFC484-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA
The EP20K200EFC484-2 is an APEX 20K family FPGA implementing Altera’s MultiCore architecture for integrated logic, product-term functions, and embedded memory. It provides 8,320 logic elements, approximately 0.106 Mbits of embedded RAM, and a high I/O count to support complex system-in-a-chip designs.
Targeted for applications that require dense programmable logic, substantial on-chip memory, and flexible I/O and clocking, this device delivers a balance of integration, configurable resources, and low-voltage operation for commercial-temperature systems.
Key Features
- Core Architecture MultiCore architecture combining LUT-based logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
- Logic Capacity 8,320 logic elements and up to 526,000 system gates for mid-density FPGA designs.
- Embedded Memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM, with ESBs usable for FIFO buffers, dual-port RAM, and CAM implementations.
- I/O and Interfaces 376 user I/Os with MultiVolt I/O support and advanced I/O options; documented support for interfaces including PCI (3.3 V), DDR SDRAM and ZBT SRAM, and LVDS signaling capability.
- Clock Management Flexible clocking with up to four PLLs, a built-in low-skew clock tree, up to eight global clock signals, and programmable features for phase/delay control and clock multiplication/division.
- Power and Supply Designed for low-power operation with an internal supply voltage around 1.8 V (product data shows 1.71–1.89 V) and ESB programmable power-saving modes.
- Package and Mounting 484-BBGA package (supplier package: 484-FBGA, 23 × 23 mm) optimized for surface-mount assembly in commercial-grade applications.
- Environmental Compliance RoHS compliant.
- Operating Range Commercial temperature rating from 0 °C to 85 °C.
Typical Applications
- Memory Interface Controllers Implement DDR SDRAM and ZBT SRAM controllers and buffering using on-chip ESBs and high-speed I/O support.
- PCI-Based Systems Support for PCI Local Bus operation (3.3 V) for host or bridge logic in platform designs requiring bus interfacing.
- SOPC and System Integration Integrate FIFOs, dual-port RAM, and CAM functions within the device to consolidate system logic and reduce external components.
- High-Speed I/O Subsystems Use LVDS channels and programmable I/O features to implement high-bandwidth serial or parallel interfaces.
Unique Advantages
- Integrated MultiCore Architecture: Combines LUT logic, product-term logic, and ESBs to handle both register- and memory-intensive functions on a single device.
- Substantial Logic and Memory Resources: 8,320 logic elements and approximately 0.106 Mbits of embedded RAM provide capacity for mid-range programmable designs.
- High I/O Density: 376 user I/Os enable complex board-level connectivity and support for multiple external memory and bus interfaces.
- Flexible Clocking: Multiple PLLs, low-skew clock tree, and programmable clock features simplify timing architectures for multi-domain designs.
- Low-Voltage Operation: Internal supply centered around 1.8 V (specified 1.71–1.89 V) supports low-power system designs while enabling MultiVolt I/O interoperability.
- Compact Surface-Mount Package: 484-BBGA (23 × 23 mm) offers a high-pin-count solution in a compact footprint for space-efficient board layouts.
Why Choose EP20K200EFC484-2?
The EP20K200EFC484-2 positions itself as a mid-density APEX 20K FPGA option that balances logic capacity, embedded memory, and extensive I/O in a commercial-temperature, RoHS-compliant package. Its MultiCore architecture and ESBs enable designers to consolidate system functions such as FIFOs and RAM on-chip, reducing external component count and simplifying board design.
This device is well-suited for developers building systems that require configurable logic, memory interfacing, and flexible I/O and clock management while operating within a commercial temperature range. Its package and power profile make it appropriate for compact, surface-mount assemblies where integration and predictable clocking are important.
Request a quote or submit a procurement inquiry to evaluate EP20K200EFC484-2 for your next FPGA design.

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