EP20K200EFC484-2

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 1,006 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC484-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

The EP20K200EFC484-2 is an APEX 20K family FPGA implementing Altera’s MultiCore architecture for integrated logic, product-term functions, and embedded memory. It provides 8,320 logic elements, approximately 0.106 Mbits of embedded RAM, and a high I/O count to support complex system-in-a-chip designs.

Targeted for applications that require dense programmable logic, substantial on-chip memory, and flexible I/O and clocking, this device delivers a balance of integration, configurable resources, and low-voltage operation for commercial-temperature systems.

Key Features

  • Core Architecture MultiCore architecture combining LUT-based logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
  • Logic Capacity 8,320 logic elements and up to 526,000 system gates for mid-density FPGA designs.
  • Embedded Memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM, with ESBs usable for FIFO buffers, dual-port RAM, and CAM implementations.
  • I/O and Interfaces 376 user I/Os with MultiVolt I/O support and advanced I/O options; documented support for interfaces including PCI (3.3 V), DDR SDRAM and ZBT SRAM, and LVDS signaling capability.
  • Clock Management Flexible clocking with up to four PLLs, a built-in low-skew clock tree, up to eight global clock signals, and programmable features for phase/delay control and clock multiplication/division.
  • Power and Supply Designed for low-power operation with an internal supply voltage around 1.8 V (product data shows 1.71–1.89 V) and ESB programmable power-saving modes.
  • Package and Mounting 484-BBGA package (supplier package: 484-FBGA, 23 × 23 mm) optimized for surface-mount assembly in commercial-grade applications.
  • Environmental Compliance RoHS compliant.
  • Operating Range Commercial temperature rating from 0 °C to 85 °C.

Typical Applications

  • Memory Interface Controllers Implement DDR SDRAM and ZBT SRAM controllers and buffering using on-chip ESBs and high-speed I/O support.
  • PCI-Based Systems Support for PCI Local Bus operation (3.3 V) for host or bridge logic in platform designs requiring bus interfacing.
  • SOPC and System Integration Integrate FIFOs, dual-port RAM, and CAM functions within the device to consolidate system logic and reduce external components.
  • High-Speed I/O Subsystems Use LVDS channels and programmable I/O features to implement high-bandwidth serial or parallel interfaces.

Unique Advantages

  • Integrated MultiCore Architecture: Combines LUT logic, product-term logic, and ESBs to handle both register- and memory-intensive functions on a single device.
  • Substantial Logic and Memory Resources: 8,320 logic elements and approximately 0.106 Mbits of embedded RAM provide capacity for mid-range programmable designs.
  • High I/O Density: 376 user I/Os enable complex board-level connectivity and support for multiple external memory and bus interfaces.
  • Flexible Clocking: Multiple PLLs, low-skew clock tree, and programmable clock features simplify timing architectures for multi-domain designs.
  • Low-Voltage Operation: Internal supply centered around 1.8 V (specified 1.71–1.89 V) supports low-power system designs while enabling MultiVolt I/O interoperability.
  • Compact Surface-Mount Package: 484-BBGA (23 × 23 mm) offers a high-pin-count solution in a compact footprint for space-efficient board layouts.

Why Choose EP20K200EFC484-2?

The EP20K200EFC484-2 positions itself as a mid-density APEX 20K FPGA option that balances logic capacity, embedded memory, and extensive I/O in a commercial-temperature, RoHS-compliant package. Its MultiCore architecture and ESBs enable designers to consolidate system functions such as FIFOs and RAM on-chip, reducing external component count and simplifying board design.

This device is well-suited for developers building systems that require configurable logic, memory interfacing, and flexible I/O and clock management while operating within a commercial temperature range. Its package and power profile make it appropriate for compact, surface-mount assemblies where integration and predictable clocking are important.

Request a quote or submit a procurement inquiry to evaluate EP20K200EFC484-2 for your next FPGA design.

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