EP20K200EFC484-2N

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 1,110 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC484-2N – APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

The EP20K200EFC484-2N is an APEX 20KE family field programmable gate array from Intel, implemented in a 484-BBGA package with surface-mount mounting. It combines a MultiCore architecture—integrating look-up table (LUT) logic, product-term logic, and embedded memory blocks (ESBs)—to support register-intensive and memory-intensive functions.

Targeted at commercial electronic designs, this device delivers a balance of logic capacity, on-chip RAM, and flexible I/O for system integration tasks such as memory interfacing, bus bridging, and custom peripheral logic while operating within a 1.71 V to 1.89 V core supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • APEX 20K MultiCore architecture – Integrates LUT logic, product-term logic, and embedded system blocks (ESBs) for efficient implementation of register-intensive and memory functions.
  • Logic capacity – 8,320 logic elements enabling complex combinatorial and sequential logic implementations consistent with the APEX 20K family.
  • Embedded memory – Approximately 0.106 Mbits of on-chip RAM (106,496 bits) for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations using ESBs.
  • System gates and macrocells – Up to 526,000 system gates and 832 macrocells for high-density designs.
  • I/O and interface flexibility – 376 user I/O pins with MultiVolt I/O support and programmable I/O features to interface with a variety of external voltages and standards.
  • Clock management – Flexible clocking with support for multiple PLLs and features such as low-skew clock tree, ClockLock, ClockBoost, and programmable phase/delay shifting.
  • High-speed I/O capability – Architecture supports high-speed external memories and differential signaling with LVDS performance noted in the APEX 20K family specifications.
  • Power and packaging – Designed for low-power operation with a core supply in the 1.71 V–1.89 V range; supplied in a 484-BBGA package (supplier package 484-FBGA 23×23) and compliant with RoHS.
  • Commercial operating range – Rated for 0 °C to 85 °C operation and intended for commercial-grade applications.

Typical Applications

  • Memory interface controllers: Use the device’s embedded RAM and high-speed I/O support for DDR SDRAM and other external memory controller implementations.
  • Bus and protocol bridging: Implement PCI/PCI-like bus interfaces and custom bridge logic leveraging the device’s flexible I/O and clock management features.
  • High-speed I/O subsystems: Deploy LVDS and other high-performance I/O signaling for data link and SERDES-adjacent functions within commercial systems.
  • Embedded logic and buffering: Create FIFOs, dual-port RAM, and CAMs using ESBs for packet buffering, queueing, and lookup functions in communication or data-path designs.

Unique Advantages

  • Integrated memory and logic: Embedded system blocks provide on-chip RAM and product-term logic that reduce external memory needs and simplify designs.
  • Substantial logic density: 8,320 logic elements and up to 526,000 system gates enable complex logic implementations without increasing board-level component count.
  • Flexible I/O and clocking: MultiVolt I/O support and robust clock-management features let you match system timing and interface requirements while preserving signal integrity.
  • Commercial-grade readiness: Specified for 0 °C to 85 °C operation and supplied in a compact 484-BBGA package suitable for space-constrained commercial electronics.
  • RoHS compliant: Meets RoHS requirements to support regulatory and environmental compliance in commercial product builds.

Why Choose EP20K200EFC484-2N?

The EP20K200EFC484-2N brings APEX 20KE family architecture into commercial FPGA designs that need a balanced mix of logic, embedded memory, and flexible I/O. Its combination of approximately 0.106 Mbits of on-chip RAM, 8,320 logic elements, and 376 I/O pins makes it well suited for designs that require integrated buffering, interface logic, and custom protocol handling.

Engineers building commercial systems will find this device appropriate for consolidating discrete functions onto a single programmable device, reducing BOM complexity and enabling tighter timing control with advanced clock management. Backed by the APEX 20K family design approach from Intel, the part is a practical option for scalable, mid-density FPGA implementations.

Request a quote to check availability and pricing for EP20K200EFC484-2N or submit your requirements to obtain a formal quotation for procurement.

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