EP20K200EFC484-2AA
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 876 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EFC484-2AA – APEX-20KE® Field Programmable Gate Array (FPGA), 8,320 LEs, 106,496-bit RAM, 376 I/O
The EP20K200EFC484-2AA is an APEX-20KE family FPGA from Intel, offering a blend of configurable logic, embedded memory, and high-density I/O in a 484-BBGA package. Based on the APEX 20K MultiCore architecture, this device targets system integration tasks that require a mix of LUT-based logic, product-term logic and embedded system blocks for memory functions.
With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 376 user I/O pins, the device is suited for commercial designs that need substantial gate density (526,000 gates) and flexible I/O while operating within standard commercial temperature and supply ranges.
Key Features
- Core architecture — MultiCore architecture integrating lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) for implementing register-intensive and memory functions.
- Logic capacity — 8,320 logic elements providing support for designs up to 526,000 gates (maximum system gates).
- Embedded memory — Total on-chip RAM of 106,496 bits (approximately 0.106 Mbits) for FIFOs, dual-port RAM and CAM implementations using ESBs.
- I/O and interfacing — 376 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and advanced I/O features described for the APEX 20K family.
- Clock and timing — Family-level support for flexible clock management including multiple PLLs, a low-skew clock tree and several clock-management features such as ClockLock, ClockBoost and ClockShift.
- Power supply — Internal supply range specified at 1.71 V to 1.89 V for the device core; designed with low-power operation modes available in ESBs.
- Package and mounting — 484-BBGA package; supplier device package reported as 484-FBGA (23×23). Surface-mount mounting type.
- Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature.
- Standards and compliance — RoHS compliant.
Typical Applications
- Embedded system integration — Use the device’s MultiCore architecture and embedded system blocks to consolidate logic and memory functions for compact SOPC-style designs.
- High-density glue logic — Implement complex glue logic and register-intensive functions using the LUT-rich fabric and 8,320 logic elements.
- Memory buffering and FIFOs — Leverage the 106,496 bits of embedded RAM and ESB features for FIFO, dual-port RAM and CAM implementations in data-path designs.
- High I/O applications — Suitable for applications requiring many I/O signals (up to 376 pins) and MultiVolt interfacing to different voltage domains.
Unique Advantages
- Significant logic density: 8,320 logic elements and up to 526,000 system gates enable substantial on-chip logic integration.
- Embedded-memory flexibility: Approximately 0.106 Mbits of on-chip RAM in ESBs supports a variety of memory functions without consuming logic resources.
- Versatile I/O support: 376 user I/Os with MultiVolt capability facilitate interfacing across multiple voltage domains and system types.
- Clock management features: Built-in PLL and clock-tree capabilities with family-level ClockLock/ClockBoost/ClockShift provide adaptable timing control for synchronous designs.
- Commercial-grade reliability: Designed for 0 °C to 85 °C operation and shipped in a surface-mount 484-BBGA package for board-level reliability in commercial applications.
- Standards-conscious design: RoHS compliance supports environmentally conscious production and deployment.
Why Choose EP20K200EFC484-2AA?
The EP20K200EFC484-2AA positions itself as a high-density, commercially graded FPGA offering a balanced combination of logic elements, embedded memory and extensive I/O capability in a compact 484-BBGA footprint. Its MultiCore architecture and ESB resources make it practical for designs that need integrated memory functions alongside LUT-based logic, while the device-level clock-management and I/O features support complex timing and interface requirements.
This device is well suited to engineering teams building commercial embedded systems, high-density glue logic, or data-path buffering solutions that require predictable supply and temperature ratings, RoHS compliance, and a robust set of family-level features for clocking and I/O management.
If you would like pricing, availability, or lead-time information for EP20K200EFC484-2AA, request a quote or submit an inquiry and our team will provide the details you need to move your design forward.

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