EP20K200EFC484-2AA

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 876 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EFC484-2AA – APEX-20KE® Field Programmable Gate Array (FPGA), 8,320 LEs, 106,496-bit RAM, 376 I/O

The EP20K200EFC484-2AA is an APEX-20KE family FPGA from Intel, offering a blend of configurable logic, embedded memory, and high-density I/O in a 484-BBGA package. Based on the APEX 20K MultiCore architecture, this device targets system integration tasks that require a mix of LUT-based logic, product-term logic and embedded system blocks for memory functions.

With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 376 user I/O pins, the device is suited for commercial designs that need substantial gate density (526,000 gates) and flexible I/O while operating within standard commercial temperature and supply ranges.

Key Features

  • Core architecture — MultiCore architecture integrating lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) for implementing register-intensive and memory functions.
  • Logic capacity — 8,320 logic elements providing support for designs up to 526,000 gates (maximum system gates).
  • Embedded memory — Total on-chip RAM of 106,496 bits (approximately 0.106 Mbits) for FIFOs, dual-port RAM and CAM implementations using ESBs.
  • I/O and interfacing — 376 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and advanced I/O features described for the APEX 20K family.
  • Clock and timing — Family-level support for flexible clock management including multiple PLLs, a low-skew clock tree and several clock-management features such as ClockLock, ClockBoost and ClockShift.
  • Power supply — Internal supply range specified at 1.71 V to 1.89 V for the device core; designed with low-power operation modes available in ESBs.
  • Package and mounting — 484-BBGA package; supplier device package reported as 484-FBGA (23×23). Surface-mount mounting type.
  • Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature.
  • Standards and compliance — RoHS compliant.

Typical Applications

  • Embedded system integration — Use the device’s MultiCore architecture and embedded system blocks to consolidate logic and memory functions for compact SOPC-style designs.
  • High-density glue logic — Implement complex glue logic and register-intensive functions using the LUT-rich fabric and 8,320 logic elements.
  • Memory buffering and FIFOs — Leverage the 106,496 bits of embedded RAM and ESB features for FIFO, dual-port RAM and CAM implementations in data-path designs.
  • High I/O applications — Suitable for applications requiring many I/O signals (up to 376 pins) and MultiVolt interfacing to different voltage domains.

Unique Advantages

  • Significant logic density: 8,320 logic elements and up to 526,000 system gates enable substantial on-chip logic integration.
  • Embedded-memory flexibility: Approximately 0.106 Mbits of on-chip RAM in ESBs supports a variety of memory functions without consuming logic resources.
  • Versatile I/O support: 376 user I/Os with MultiVolt capability facilitate interfacing across multiple voltage domains and system types.
  • Clock management features: Built-in PLL and clock-tree capabilities with family-level ClockLock/ClockBoost/ClockShift provide adaptable timing control for synchronous designs.
  • Commercial-grade reliability: Designed for 0 °C to 85 °C operation and shipped in a surface-mount 484-BBGA package for board-level reliability in commercial applications.
  • Standards-conscious design: RoHS compliance supports environmentally conscious production and deployment.

Why Choose EP20K200EFC484-2AA?

The EP20K200EFC484-2AA positions itself as a high-density, commercially graded FPGA offering a balanced combination of logic elements, embedded memory and extensive I/O capability in a compact 484-BBGA footprint. Its MultiCore architecture and ESB resources make it practical for designs that need integrated memory functions alongside LUT-based logic, while the device-level clock-management and I/O features support complex timing and interface requirements.

This device is well suited to engineering teams building commercial embedded systems, high-density glue logic, or data-path buffering solutions that require predictable supply and temperature ratings, RoHS compliance, and a robust set of family-level features for clocking and I/O management.

If you would like pricing, availability, or lead-time information for EP20K200EFC484-2AA, request a quote or submit an inquiry and our team will provide the details you need to move your design forward.

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