EP20K200EF484C3NGZ

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 1,369 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EF484C3NGZ – APEX-20KE® Field Programmable Gate Array (FPGA), 484-BBGA

The EP20K200EF484C3NGZ is an APEX-20KE family FPGA from Intel, delivered in a 484-BBGA surface-mount package. It integrates MultiCore architecture elements—including LUT-based logic and embedded system blocks (ESBs)—to support designs that require programmable logic, on-chip memory, and flexible I/O.

Targeted at commercial applications, this device provides a high-density logic fabric (526,000 gates) with 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 376 user I/Os for complex interfacing and system integration.

Key Features

  • Core Architecture  MultiCore architecture with LUT logic and product-term logic for register- and combinatorial-intensive functions; device density rated at 526,000 gates and 8,320 logic elements.
  • Embedded Memory  Approximately 0.106 Mbits of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM, and content-addressable memory (CAM) use cases.
  • I/O and Interfaces  376 user I/Os with MultiVolt I/O support and programmable I/O features; family-level support for high-speed memory interfaces and LVDS-type signaling as described in the APEX 20K family data.
  • Clock Management  Flexible clock management including up to four phase-locked loops (PLLs), low-skew clock tree, and multiple global clock signals for deterministic timing.
  • Power and Voltage  Designed for low-power operation with a supply voltage range of 1.71 V to 1.89 V and features in the APEX 20K family for power-saving ESB modes.
  • Package and Mounting  484-BBGA package (surface mount) with a 23 × 23 ball array footprint; RoHS-compliant and specified for commercial-grade operating temperatures.
  • Operating Range  Commercial operating temperature range of 0 °C to 85 °C.

Typical Applications

  • High-speed memory interfaces  Use the device to implement DDR SDRAM or ZBT SRAM controllers and buffers leveraging embedded RAM and dedicated I/O capabilities described for the APEX 20K family.
  • PCI and bus bridging  Suitable for designs that require PCI 3.3-V interfacing at 33/66 MHz as supported at the family level for 3.3-V operation.
  • Serial links and differential signaling  Implement LVDS and other differential I/O use cases using the device’s multi-voltage I/O support and high-speed I/O feature set.
  • Embedded logic and data processing  Deploy the FPGA for custom datapaths, protocol processing, and glue-logic where a balance of logic density (8,320 logic elements) and embedded memory is required.

Unique Advantages

  • High-density programmable fabric: 526,000 gates and 8,320 logic elements provide room for complex logic and control functions without external ASICs.
  • On-chip embedded memory: ESBs offer integrated RAM resources (approximately 0.106 Mbits) for FIFOs, dual-port RAM, and CAM implementations, reducing external memory dependency.
  • Flexible clocking: Multiple PLLs and global clocks enable precise clock distribution and phase/shift control for timing-critical designs.
  • Robust I/O capability: 376 user I/Os and MultiVolt support allow direct interfacing with a wide range of peripherals and memory devices at the family-specified I/O voltage levels.
  • Commercial temperature and RoHS compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS-compliant for global manufacturing requirements.
  • Surface-mount 484-BBGA package: Compact 23 × 23 ball-array packaging supports space-constrained board designs while providing a high pin count.

Why Choose EP20K200EF484C3NGZ?

The EP20K200EF484C3NGZ combines the APEX-20KE family’s MultiCore architecture with a high-density logic count and embedded memory to address designs that need integrated programmable logic, on-chip RAM, and flexible I/O. Its commercial-grade temperature rating, 484-BBGA surface-mount package, and RoHS compliance make it suitable for a wide range of commercial electronic products.

Choose this FPGA when your design requires a balance of logic resources (8,320 logic elements), significant gate density (526,000 gates), and a large I/O count (376 pins) in a compact package supported by the APEX 20K family feature set.

Request a quote or submit an inquiry to receive pricing and availability for EP20K200EF484C3NGZ.

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