EP20K200EF484C3NGZ
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 1,369 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EF484C3NGZ – APEX-20KE® Field Programmable Gate Array (FPGA), 484-BBGA
The EP20K200EF484C3NGZ is an APEX-20KE family FPGA from Intel, delivered in a 484-BBGA surface-mount package. It integrates MultiCore architecture elements—including LUT-based logic and embedded system blocks (ESBs)—to support designs that require programmable logic, on-chip memory, and flexible I/O.
Targeted at commercial applications, this device provides a high-density logic fabric (526,000 gates) with 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 376 user I/Os for complex interfacing and system integration.
Key Features
- Core Architecture MultiCore architecture with LUT logic and product-term logic for register- and combinatorial-intensive functions; device density rated at 526,000 gates and 8,320 logic elements.
- Embedded Memory Approximately 0.106 Mbits of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM, and content-addressable memory (CAM) use cases.
- I/O and Interfaces 376 user I/Os with MultiVolt I/O support and programmable I/O features; family-level support for high-speed memory interfaces and LVDS-type signaling as described in the APEX 20K family data.
- Clock Management Flexible clock management including up to four phase-locked loops (PLLs), low-skew clock tree, and multiple global clock signals for deterministic timing.
- Power and Voltage Designed for low-power operation with a supply voltage range of 1.71 V to 1.89 V and features in the APEX 20K family for power-saving ESB modes.
- Package and Mounting 484-BBGA package (surface mount) with a 23 × 23 ball array footprint; RoHS-compliant and specified for commercial-grade operating temperatures.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C.
Typical Applications
- High-speed memory interfaces Use the device to implement DDR SDRAM or ZBT SRAM controllers and buffers leveraging embedded RAM and dedicated I/O capabilities described for the APEX 20K family.
- PCI and bus bridging Suitable for designs that require PCI 3.3-V interfacing at 33/66 MHz as supported at the family level for 3.3-V operation.
- Serial links and differential signaling Implement LVDS and other differential I/O use cases using the device’s multi-voltage I/O support and high-speed I/O feature set.
- Embedded logic and data processing Deploy the FPGA for custom datapaths, protocol processing, and glue-logic where a balance of logic density (8,320 logic elements) and embedded memory is required.
Unique Advantages
- High-density programmable fabric: 526,000 gates and 8,320 logic elements provide room for complex logic and control functions without external ASICs.
- On-chip embedded memory: ESBs offer integrated RAM resources (approximately 0.106 Mbits) for FIFOs, dual-port RAM, and CAM implementations, reducing external memory dependency.
- Flexible clocking: Multiple PLLs and global clocks enable precise clock distribution and phase/shift control for timing-critical designs.
- Robust I/O capability: 376 user I/Os and MultiVolt support allow direct interfacing with a wide range of peripherals and memory devices at the family-specified I/O voltage levels.
- Commercial temperature and RoHS compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS-compliant for global manufacturing requirements.
- Surface-mount 484-BBGA package: Compact 23 × 23 ball-array packaging supports space-constrained board designs while providing a high pin count.
Why Choose EP20K200EF484C3NGZ?
The EP20K200EF484C3NGZ combines the APEX-20KE family’s MultiCore architecture with a high-density logic count and embedded memory to address designs that need integrated programmable logic, on-chip RAM, and flexible I/O. Its commercial-grade temperature rating, 484-BBGA surface-mount package, and RoHS compliance make it suitable for a wide range of commercial electronic products.
Choose this FPGA when your design requires a balance of logic resources (8,320 logic elements), significant gate density (526,000 gates), and a large I/O count (376 pins) in a compact package supported by the APEX 20K family feature set.
Request a quote or submit an inquiry to receive pricing and availability for EP20K200EF484C3NGZ.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018