EP20K200EBC356-3

IC FPGA 271 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

Quantity 522 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O271Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EBC356-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

The EP20K200EBC356-3 is an APEX-20KE family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic and embedded system blocks (ESBs) for memory and product-term functions. It targets designs that require significant on-chip logic and embedded memory alongside flexible I/O and clock management.

With 8,320 logic elements, approximately 106,496 bits of embedded memory, and 271 user I/O pins in a 356-LBGA package, this device is suitable for applications needing compact, programmable logic with multi-voltage I/O support and configurable clock resources.

Key Features

  • Core architecture  MultiCore architecture combining LUT logic and ESB resources for register‑intensive and memory‑centric functions.
  • Logic capacity  8,320 logic elements and 526,000 system gates provide significant combinational and sequential logic density for mid-range designs.
  • Embedded memory  Approximately 106,496 bits of on-chip RAM available for FIFOs, dual-port RAM, and content-addressable memory (CAM) implementations via ESBs.
  • I/O and interface flexibility  271 user I/O pins with MultiVolt I/O interface support for interoperability with 1.8 V, 2.5 V, 3.3 V, and 5.0 V devices (family-level support documented in the datasheet).
  • Clock management  Flexible clock resources including up to four phase-locked loops (PLLs), a built-in low-skew clock tree and up to eight global clock signals for complex timing domains.
  • Power and supply  Internal supply centered around 1.8 V with specified device supply range of 1.71 V to 1.89 V and device-level low-power features described in the family documentation.
  • Package and mounting  356‑ball LFBGA (35 mm × 35 mm) surface-mount package suitable for high‑density board layouts.
  • Commercial temperature range  Rated for 0 °C to 85 °C operation for commercial applications.
  • Compliance  RoHS compliant.

Typical Applications

  • Memory interface and buffering  Implement FIFOs, dual-port RAM, and memory controllers using the device’s embedded system blocks and on-chip RAM.
  • Custom I/O bridging and protocol handling  MultiVolt I/O support and abundant I/O pins enable protocol conversion and interface bridging across different logic levels.
  • Embedded logic and control  LUT-based logic and dedicated carry chains make the device suitable for custom control logic, state machines, and peripheral offload.
  • Mid-range system integration  System-on-programmable-chip (SOPC) style integration combining logic and embedded memory for compact system designs.

Unique Advantages

  • Integrated memory and logic: Embedded system blocks provide on-chip RAM and product-term logic, reducing the need for external memory in many designs.
  • Significant on-chip resources: 8,320 logic elements and roughly 106 kbits of embedded memory support moderate-density logic and data buffering within a single device.
  • Flexible clocking: Multiple PLLs and a low-skew clock tree enable reliable multi-domain timing strategies without external clock management ICs.
  • Multi-voltage I/O compatibility: Support for multiple I/O voltage levels enables direct interfacing to a broad range of peripheral devices.
  • Compact BGA package: 356-BGA (35 × 35 mm) package allows high I/O count and denser PCB routing in space-constrained designs.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose EP20K200EBC356-3?

The EP20K200EBC356-3 provides a balanced combination of logic density, embedded memory, and flexible I/O in the APEX‑20K family architecture. It is well suited for designers who need a mid-range FPGA that integrates LUT-based logic, ESB memory functions, and robust clocking features within a compact 356-LBGA package.

For projects requiring embedded FIFOs, custom protocol handling, or consolidated system logic with multi-voltage I/O compatibility, this device offers measurable on-chip resources and family-documented features that simplify board-level design and reduce external component count.

Request a quote or submit an RFQ to begin procurement and evaluate EP20K200EBC356-3 for your next design.

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