EP20K200EBC356-1X

IC FPGA 271 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

Quantity 440 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O271Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EBC356-1X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

The EP20K200EBC356-1X is an APEX-20KE® family FPGA from Intel, built on a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks for system-on-a-programmable-chip (SOPC) integration. This commercial-grade, surface-mount device delivers 8,320 logic elements, approximately 0.106 Mbits (106,496 bits) of embedded memory, and 271 user I/O pins in a 356-LBGA package.

Designed for applications that require medium-to-high logic density with flexible I/O and embedded memory, the device offers family-level clock management features and a range of I/O standards to support high-speed interfaces and embedded system designs.

Key Features

  • Core architecture MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) to implement register-intensive and memory functions.
  • Logic density 8,320 logic elements and 526,000 system gates provide on-chip resources for complex logic implementations.
  • Embedded memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM for FIFOs, dual-port RAM, and other memory functions implemented within ESBs.
  • I/O and interface flexibility 271 user I/O pins with MultiVolt I/O interface support to interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V devices; supports advanced I/O standards and high-speed signaling.
  • Clock management Family-level features include up to four phase-locked loops (PLLs), multiple global clock signals, low-skew clock tree, and programmable clock phase/delay functionality.
  • Power and supply Internal supply and device operation designed for low-power use with a specified voltage supply range of 1.71 V to 1.89 V.
  • Package and mounting 356-LBGA (356-BGA, 35×35) surface-mount package for compact board-level integration.
  • Operating range and compliance Commercial-grade operating temperature 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded systems and SOPC Use the integrated LUTs and ESBs to implement embedded processors, on-chip peripherals, and SOPC designs with consolidated logic and memory.
  • High-speed interface bridging MultiVolt I/O and support for advanced I/O standards make the device suitable for protocol bridging and interface adaptation across voltage domains.
  • Memory controller and buffering On-chip ESB memory supports FIFO buffers and dual-port RAM useful for DDR/SDRAM buffering and interface control functions.
  • Custom logic and prototyping Medium-high logic density and a compact LBGA package support board-level prototyping and custom logic acceleration tasks.

Unique Advantages

  • Highly integrated architecture: Combines LUT logic, product-term logic, and ESB memory to reduce external component count and simplify board design.
  • Balanced logic and memory resources: 8,320 logic elements paired with approximately 0.106 Mbits of embedded RAM deliver a practical mix for control, buffering, and data path functions.
  • Flexible I/O interfacing: MultiVolt I/O support enables direct interfacing with a range of legacy and modern voltage domains without extensive level-shifting.
  • Robust clock control: PLLs and programmable clock features enable precise clocking strategies for synchronous designs and multi-clock domains.
  • Compact surface-mount package: 356-LBGA (35×35) package allows dense PCB integration while maintaining ample I/O and logic capacity.
  • Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for environmental conformity.

Why Choose EP20K200EBC356-1X?

The EP20K200EBC356-1X is positioned for designs that need a balanced combination of logic density, embedded memory, and flexible I/O in a compact LBGA package. Its MultiCore APEX-20KE architecture and ESB memory blocks enable integration of control logic, buffering, and custom functions on a single device, reducing system complexity and BOM count.

This device is well suited for engineers developing embedded systems, high-speed interface logic, and memory-interfacing controllers who require verifiable on-chip resources, clear supply and temperature specifications, and the APEX 20K family feature set.

Request a quote or submit a product inquiry to check availability and pricing for EP20K200EBC356-1X.

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