EP20K200EBC356-1X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA |
|---|---|
| Quantity | 440 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EBC356-1X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA
The EP20K200EBC356-1X is an APEX-20KE® family FPGA from Intel, built on a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks for system-on-a-programmable-chip (SOPC) integration. This commercial-grade, surface-mount device delivers 8,320 logic elements, approximately 0.106 Mbits (106,496 bits) of embedded memory, and 271 user I/O pins in a 356-LBGA package.
Designed for applications that require medium-to-high logic density with flexible I/O and embedded memory, the device offers family-level clock management features and a range of I/O standards to support high-speed interfaces and embedded system designs.
Key Features
- Core architecture MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) to implement register-intensive and memory functions.
- Logic density 8,320 logic elements and 526,000 system gates provide on-chip resources for complex logic implementations.
- Embedded memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM for FIFOs, dual-port RAM, and other memory functions implemented within ESBs.
- I/O and interface flexibility 271 user I/O pins with MultiVolt I/O interface support to interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V devices; supports advanced I/O standards and high-speed signaling.
- Clock management Family-level features include up to four phase-locked loops (PLLs), multiple global clock signals, low-skew clock tree, and programmable clock phase/delay functionality.
- Power and supply Internal supply and device operation designed for low-power use with a specified voltage supply range of 1.71 V to 1.89 V.
- Package and mounting 356-LBGA (356-BGA, 35×35) surface-mount package for compact board-level integration.
- Operating range and compliance Commercial-grade operating temperature 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded systems and SOPC Use the integrated LUTs and ESBs to implement embedded processors, on-chip peripherals, and SOPC designs with consolidated logic and memory.
- High-speed interface bridging MultiVolt I/O and support for advanced I/O standards make the device suitable for protocol bridging and interface adaptation across voltage domains.
- Memory controller and buffering On-chip ESB memory supports FIFO buffers and dual-port RAM useful for DDR/SDRAM buffering and interface control functions.
- Custom logic and prototyping Medium-high logic density and a compact LBGA package support board-level prototyping and custom logic acceleration tasks.
Unique Advantages
- Highly integrated architecture: Combines LUT logic, product-term logic, and ESB memory to reduce external component count and simplify board design.
- Balanced logic and memory resources: 8,320 logic elements paired with approximately 0.106 Mbits of embedded RAM deliver a practical mix for control, buffering, and data path functions.
- Flexible I/O interfacing: MultiVolt I/O support enables direct interfacing with a range of legacy and modern voltage domains without extensive level-shifting.
- Robust clock control: PLLs and programmable clock features enable precise clocking strategies for synchronous designs and multi-clock domains.
- Compact surface-mount package: 356-LBGA (35×35) package allows dense PCB integration while maintaining ample I/O and logic capacity.
- Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for environmental conformity.
Why Choose EP20K200EBC356-1X?
The EP20K200EBC356-1X is positioned for designs that need a balanced combination of logic density, embedded memory, and flexible I/O in a compact LBGA package. Its MultiCore APEX-20KE architecture and ESB memory blocks enable integration of control logic, buffering, and custom functions on a single device, reducing system complexity and BOM count.
This device is well suited for engineers developing embedded systems, high-speed interface logic, and memory-interfacing controllers who require verifiable on-chip resources, clear supply and temperature specifications, and the APEX 20K family feature set.
Request a quote or submit a product inquiry to check availability and pricing for EP20K200EBC356-1X.

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