EP20K200EBC356-2X

IC FPGA 271 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

Quantity 50 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O271Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EBC356-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA

The EP20K200EBC356-2X is an APEX-20KE® family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory blocks. With 8,320 logic elements, 106,496 bits of on-chip RAM and support for flexible clock and I/O features, this device targets designs that require mid-range programmable logic density with embedded memory and versatile interfacing options.

This commercial-grade, surface-mount FPGA is suited for programmable system integration where compact packaging, multi-voltage I/O support and deterministic clock management are important design drivers.

Key Features

  • MultiCore architecture Integrates LUT logic, product-term logic and embedded system blocks (ESBs) for combining register-intensive and memory-intensive functions on-chip.
  • Logic density 8,320 logic elements providing a hardware capacity equivalent to 526,000 system gates for mid-range programmable designs.
  • Embedded memory 106,496 total RAM bits (approximately 0.106 Mbits) with ESB support for FIFO, dual-port RAM and CAM implementations.
  • I/O and interface flexibility 271 user I/Os with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and programmable output features for interfacing with a wide range of peripherals and memory devices.
  • Clock management Built-in clock resources including up to four phase-locked loops (PLLs), a low-skew clock tree and features for clock phase/delay shifting and clock multiplication/division.
  • Power and supply Designed for low-power operation with an internal voltage supply range of 1.71 V to 1.89 V and ESB power-saving modes.
  • Package and mounting 356-LBGA (356-BGA, 35 × 35) surface-mount package providing a compact footprint for dense board designs.
  • Commercial temperature and compliance Rated for 0 °C to +85 °C operation and RoHS compliant for regulatory and assembly compatibility.

Typical Applications

  • Embedded systems — Implement custom control logic, state machines and on-chip memory structures where integration of logic and RAM reduces external component count.
  • Memory interface bridging — Use the ESBs and flexible I/O to build interfaces for external memory types such as DDR SDRAM and ZBT SRAM.
  • High-speed serial and parallel I/O — Support LVDS and other high-speed signaling standards with programmable I/O features for data communication links.
  • PCI and peripheral controllers — Implement bus interfaces and custom peripheral logic leveraging the device’s I/O flexibility and clock management resources.

Unique Advantages

  • Integrated memory and logic: Reduces bill of materials by enabling on-chip FIFO, dual-port RAM and CAM implementations using ESBs.
  • Mid-range logic capacity: 8,320 logic elements and ~526,000 gates provide the capability to implement complex control and data-path functions without unnecessary oversizing.
  • Flexible I/O voltage support: MultiVolt I/O compatibility minimizes level-shifting components when interfacing with mixed-voltage systems.
  • Deterministic clocking: Multiple PLLs and a low-skew clock tree simplify timing closure for multi-clock designs.
  • Compact, manufacturable package: 356-LBGA surface-mount package balances pin count and PCB density for space-constrained boards.
  • Commercial temperature and RoHS: Designed for 0 °C to +85 °C operation and RoHS compliance to ease regulatory and assembly considerations.

Why Choose EP20K200EBC356-2X?

The EP20K200EBC356-2X delivers a balanced combination of logic capacity, embedded RAM and flexible I/O and clock management suited to mid-range programmable systems. Its MultiCore architecture and ESBs let designers consolidate logic and memory functions on a single device, simplifying designs and reducing external components.

This FPGA is an appropriate choice for development teams and OEMs building commercial-temperature embedded systems, memory interface bridges, peripheral controllers and high-speed I/O applications that require a compact 356-LBGA package and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to receive pricing and availability for the EP20K200EBC356-2X.

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