EP20K200EBC356-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA |
|---|---|
| Quantity | 50 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EBC356-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 271 106496 8320 356-LBGA
The EP20K200EBC356-2X is an APEX-20KE® family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory blocks. With 8,320 logic elements, 106,496 bits of on-chip RAM and support for flexible clock and I/O features, this device targets designs that require mid-range programmable logic density with embedded memory and versatile interfacing options.
This commercial-grade, surface-mount FPGA is suited for programmable system integration where compact packaging, multi-voltage I/O support and deterministic clock management are important design drivers.
Key Features
- MultiCore architecture Integrates LUT logic, product-term logic and embedded system blocks (ESBs) for combining register-intensive and memory-intensive functions on-chip.
- Logic density 8,320 logic elements providing a hardware capacity equivalent to 526,000 system gates for mid-range programmable designs.
- Embedded memory 106,496 total RAM bits (approximately 0.106 Mbits) with ESB support for FIFO, dual-port RAM and CAM implementations.
- I/O and interface flexibility 271 user I/Os with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and programmable output features for interfacing with a wide range of peripherals and memory devices.
- Clock management Built-in clock resources including up to four phase-locked loops (PLLs), a low-skew clock tree and features for clock phase/delay shifting and clock multiplication/division.
- Power and supply Designed for low-power operation with an internal voltage supply range of 1.71 V to 1.89 V and ESB power-saving modes.
- Package and mounting 356-LBGA (356-BGA, 35 × 35) surface-mount package providing a compact footprint for dense board designs.
- Commercial temperature and compliance Rated for 0 °C to +85 °C operation and RoHS compliant for regulatory and assembly compatibility.
Typical Applications
- Embedded systems — Implement custom control logic, state machines and on-chip memory structures where integration of logic and RAM reduces external component count.
- Memory interface bridging — Use the ESBs and flexible I/O to build interfaces for external memory types such as DDR SDRAM and ZBT SRAM.
- High-speed serial and parallel I/O — Support LVDS and other high-speed signaling standards with programmable I/O features for data communication links.
- PCI and peripheral controllers — Implement bus interfaces and custom peripheral logic leveraging the device’s I/O flexibility and clock management resources.
Unique Advantages
- Integrated memory and logic: Reduces bill of materials by enabling on-chip FIFO, dual-port RAM and CAM implementations using ESBs.
- Mid-range logic capacity: 8,320 logic elements and ~526,000 gates provide the capability to implement complex control and data-path functions without unnecessary oversizing.
- Flexible I/O voltage support: MultiVolt I/O compatibility minimizes level-shifting components when interfacing with mixed-voltage systems.
- Deterministic clocking: Multiple PLLs and a low-skew clock tree simplify timing closure for multi-clock designs.
- Compact, manufacturable package: 356-LBGA surface-mount package balances pin count and PCB density for space-constrained boards.
- Commercial temperature and RoHS: Designed for 0 °C to +85 °C operation and RoHS compliance to ease regulatory and assembly considerations.
Why Choose EP20K200EBC356-2X?
The EP20K200EBC356-2X delivers a balanced combination of logic capacity, embedded RAM and flexible I/O and clock management suited to mid-range programmable systems. Its MultiCore architecture and ESBs let designers consolidate logic and memory functions on a single device, simplifying designs and reducing external components.
This FPGA is an appropriate choice for development teams and OEMs building commercial-temperature embedded systems, memory interface bridges, peripheral controllers and high-speed I/O applications that require a compact 356-LBGA package and RoHS-compliant manufacturing.
Request a quote or submit an inquiry to receive pricing and availability for the EP20K200EBC356-2X.

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