EP20K200EBC652-3

The EP20K200EBC652-3 is an APEX-20KE® Field Programmable Gate Array (FPGA) in a 652-ball BGA package, offered as a commercial-grade, surface-mount device. It provides a balanced mix of logic capacity, embedded memory, and I/O density for programmable logic implementations and system integration in commercial electronics.

Key Features

• Logic Capacity — 8,320 logic elements supporting complex custom logic and routing; overall device gate count listed as 526,000 gates.
• Embedded Memory — Approximately 106,496 bits of on-chip RAM for local buffering, state storage, and small data structures.
• I/O Density — 376 available I/O pins to support multiple external interfaces and parallel connectivity.
• Power — Operates from a core supply voltage range of 1.71 V to 1.89 V, enabling defined power budgeting for system design.
• Package & Mounting — 652-BGA package (45 × 45 mm), surface-mount compatible for compact board layouts and automated assembly.
• Operating Conditions — Commercial temperature rating with an operating range of 0 °C to 85 °C suitable for general-purpose commercial applications.
• Environmental Compliance — RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Embedded Systems & Prototyping — Implement custom logic, glue logic, or prototype hardware functions where reprogrammability and moderate logic density are required.
• Communications & Networking — Support interface bridging, packet handling, and protocol translation using the device’s logic density and I/O resources.
• Signal Processing & Acceleration — Perform device-level preprocessing and deterministic data-path operations using the available logic elements and embedded RAM.
• Custom Peripherals & Interface Control — Implement peripheral controllers, bus interfaces, and timing logic leveraging the high I/O count.

Unique Advantages

• High Logic Density: 8,320 logic elements and 526,000 gates provide substantial capacity for medium-complexity designs without moving to larger device classes.
• On-Chip Memory Support: Approximately 106,496 bits of embedded RAM reduce external memory requirements for local buffering and stateful logic.
• Extensive I/O: 376 I/O pins enable flexible connectivity to peripherals, interfaces, and parallel buses, simplifying board-level integration.
• Compact BGA Packaging: 652-ball, 45 × 45 mm BGA minimizes PCB footprint while enabling high pin count and reliable surface-mount assembly.
• Predictable Power Range: Well-defined core supply window (1.71 V–1.89 V) allows clear power-supply planning and thermal budgeting.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs and manufacturing workflows.

Why Choose EP20K200EBC652-3?

The EP20K200EBC652-3 positions itself as a commercial-grade FPGA option that combines mid-range logic capacity, embedded memory, and high I/O density in a compact 652-BGA surface-mount package. It is suited to engineers and teams implementing custom logic, interface bridging, or moderate signal-processing tasks in commercial electronic products and prototypes.

With clear electrical and environmental specifications—including a defined core voltage range, commercial operating temperature, and RoHS compliance—this device supports predictable system design, streamlined integration, and compliance with common manufacturing requirements.

Request a quote or submit an inquiry including the part number EP20K200EBC652-3 to check pricing and availability for your next design.