EP20K200EBC356-2

The EP20K200EBC356-2 is a commercial-grade APEX-20KE® Field Programmable Gate Array (FPGA) supplied in a 356-ball LBGA package. It provides a balance of on-chip logic, embedded memory, and a high I/O count for board-level programmable logic integration.

Designed for commercial embedded designs, the device targets applications that require moderate logic capacity, substantial I/O, and a compact surface-mount package while operating from a 1.71 V to 1.89 V supply and across a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity  Contains 8,320 logic elements and approximately 526,000 system gates to implement custom digital logic and state machines.
• Embedded Memory  Provides 106,496 bits of on-chip RAM (approximately 0.106 Mbits) for FIFO, buffer, and small data storage needs.
• I/O Resources  Offers 271 user I/O pins to support multiple parallel interfaces and board-level signal routing.
• Power and Supply  Operates from a specified core supply range of 1.71 V to 1.89 V, enabling predictable core power design.
• Package and Mounting  Packaged in a 356-LBGA (356-BGA, 35 × 35 mm) surface-mount package for compact PCB integration and reliable solder attachment.
• Operating Range  Commercial-grade device qualified for operation from 0 °C to 85 °C ambient.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to implement custom logic, interface glue, and control functions in commercial electronic products operating within the specified temperature range.
• Board-Level I/O Expansion  Leverage 271 I/O pins to add parallel and mixed-signal interfaces or glue logic in compact system designs.
• Prototyping and Design Validation  Deploy the device for verification of custom digital functions and small-scale prototype systems that require reprogrammable logic.

Unique Advantages

• Moderate Logic Density:  8,320 logic elements enable implementation of mid-scale digital systems without excessive board-level integration.
• High I/O Count:  271 user I/Os simplify interface routing and reduce the need for external multiplexing or I/O expanders.
• On-Chip Memory:  Approximately 0.106 Mbits of embedded RAM supports buffering, small tables, and temporary data storage inside the FPGA fabric.
• Compact LBGA Package:  356-LBGA (35 × 35 mm) minimizes PCB footprint while supporting surface-mount assembly processes.
• Commercial Temperature Rating:  Specified operation from 0 °C to 85 °C aligns with a wide range of commercial product requirements.
• RoHS Compliant:  Facilitates compliance with lead-free manufacturing and environmental regulations.

Why Choose EP20K200EBC356-2?

The EP20K200EBC356-2 delivers a practical combination of logic elements, on-chip memory, and a high I/O count in a compact 356-LBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for production-targeted embedded designs that require reprogrammable logic with reliable board-level integration.

This device is well suited to engineers and procurement teams specifying FPGA-based solutions for mid-complexity projects where predictable supply voltage, moderate embedded memory, and abundant I/O are key selection factors.

Request a quote or submit an inquiry to obtain pricing and availability for EP20K200EBC356-2 and to discuss lead times for your production requirements.