EP2A70B724C7
| Part Description |
APEX II Field Programmable Gate Array (FPGA) IC 540 1146880 67200 724-BBGA, FCBGA |
|---|---|
| Quantity | 875 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 724-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 724-BBGA, FCBGA | Number of I/O | 540 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 6720 | Number of Logic Elements/Cells | 67200 | ||
| Number of Gates | 5250000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1146880 |
Overview of EP2A70B724C7 – APEX II Field Programmable Gate Array (FPGA) IC, 67,200 Logic Elements
The EP2A70B724C7 is an APEX II Field Programmable Gate Array (FPGA) from Altera, offered in a 724-BBGA FCBGA surface-mount package (35 × 35 mm). It provides high logic density and extensive I/O capacity for complex programmable logic implementations.
With 67,200 logic elements, approximately 1.15 Mbits of embedded memory, and 540 user I/O pins, this commercial-grade FPGA is designed for designs that require significant gate count and on-chip resources while operating within a 0 °C to 85 °C temperature range and a supply voltage window of 1.425 V to 1.575 V.
Key Features
- Logic Density Provides 67,200 logic elements to implement substantial custom digital logic and control functions.
- Embedded Memory Approximately 1.15 Mbits of on-chip RAM to support buffering, state storage, and logic persistence without external memory.
- I/O Capacity 540 user I/O pins enable broad connectivity for parallel interfaces, peripherals, and board-level integration.
- Gate Count Rated at 5,250,000 gates to indicate the overall logic capacity available for complex designs.
- Power and Electrical Operates from a supply voltage of 1.425 V to 1.575 V, suitable for systems designed around this core voltage.
- Package & Mounting 724-BBGA (FCBGA) package, 35 × 35 mm, surface-mount for compact board-level integration.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant construction for regulatory alignment in standard commercial applications.
Typical Applications
- Custom Digital Logic Implement complex, application-specific digital functions using the device's large logic-element count and gate capacity.
- High I/O Systems Deploy in designs that require many parallel signals or peripheral interfaces, leveraging 540 user I/Os.
- On-chip Memory-Dependent Designs Use the FPGA's embedded memory for buffering, state machines, and temporary storage without immediate need for external RAM.
Unique Advantages
- High Logic Integration: 67,200 logic elements enable dense implementations of custom logic, reducing the need for multiple discrete devices.
- Substantial Embedded Memory: Approximately 1.15 Mbits of on-chip RAM lets designers keep critical data local to the FPGA fabric for lower system complexity.
- Extensive I/O Resource: 540 I/O pins provide flexibility for interfacing to multiple peripherals, buses, and board-level signals.
- Significant Gate Count: 5,250,000 gates indicate the FPGA’s capacity for implementing complex state machines and logic-rich functions.
- Compact BGA Package: 724-BBGA (35 × 35 mm) surface-mount package supports high-density board layouts while maintaining a standardized form factor.
- Regulatory Compliance: RoHS compliance supports deployment in commercial environments requiring lead-free components.
Why Choose EP2A70B724C7?
The EP2A70B724C7 positions itself as a mid-to-high density FPGA option within the APEX II family, combining 67,200 logic elements, approximately 1.15 Mbits of embedded memory, and 540 I/Os in a single 724-BBGA surface-mount package. Its gate capacity and on-chip resources make it suitable for designs that require consolidated programmable logic and substantial connectivity while operating within commercial temperature and voltage ranges.
This device is appropriate for teams and projects that need scalable logic integration with a compact package footprint and RoHS compliance, offering a balance of gate count, memory, and I/O to support a variety of programmable logic implementations.
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