EP2A70F1508C7

The EP2A70F1508C7 is an APEX II field programmable gate array (FPGA) from Altera, configured in a 1508-BBGA (FCBGA) package. It delivers high logic capacity and extensive I/O in a surface-mount package for commercial electronic designs.

With 67,200 logic elements, approximately 1.15 Mbits of on-chip RAM and 1,060 I/Os, this device is suited to systems that require significant programmable logic, large memory buffers and high connectivity within a single FPGA footprint.

Key Features

• Logic Capacity — 67,200 logic elements providing substantial on-chip programmable logic for complex designs.
• Embedded Memory — Approximately 1.15 Mbits of total on-chip RAM bits for buffering, FIFOs and local data storage.
• I/O Density — 1,060 general-purpose I/O pins to support high‑connectivity applications and multiple external interfaces.
• Gate Count — 5,250,000 equivalent gates enabling implementation of large logic functions and system integration.
• Power Supply — Core supply range of 1.425 V to 1.575 V to match system power rails and ensure stable core operation.
• Package & Mounting — 1508-BBGA, FCBGA surface-mount package; supplier device package listed as 1508-FBGA (40×40) for high pin count board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard electronics environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density I/O systems — Use the device where a large number of external interfaces and signal routing are required on a single FPGA.
• Data buffering and protocol handling — Leverage the on-chip RAM and logic resources to implement packet buffering, protocol bridges and interface logic.
• Board-level system integration — Consolidate multiple discrete logic functions into one FPGA to reduce component count and PCB complexity.

Unique Advantages

• High logic density: 67,200 logic elements enable consolidation of complex digital logic into a single device, reducing system BOM.
• Generous on-chip memory: Approximately 1.15 Mbits of embedded RAM supports local buffering and memory-intensive functions without adding external memory.
• Extensive I/O count: 1,060 I/Os accommodate multiple peripherals, interfaces and board-level signals without extensive multiplexing.
• Robust gate budget: 5,250,000 gates provide headroom for expanding functionality as design requirements evolve.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in standard commercial electronics applications.
• RoHS compliant: Environmentally compliant for use in products targeting RoHS requirements.

Why Choose EP2A70F1508C7?

The EP2A70F1508C7 combines substantial logic resources, significant embedded memory and one of the highest I/O counts available in its package size to offer a compact, highly integrated solution for commercial electronic designs. Its 1508-BBGA surface-mount package enables board-level consolidation where space and connectivity matter.

This FPGA is well suited to designers and teams building systems that need high integration of logic and interfaces, scalable on-chip memory, and a commercial temperature operating range. Its specification set makes it a practical choice for consolidating discrete functions and simplifying board-level architectures.

Request a quote or submit a procurement inquiry to evaluate EP2A70F1508C7 for your next design.