EP2A70F1508C9

The EP2A70F1508C9 is an Altera APEX II Field Programmable Gate Array (FPGA) IC designed for commercial electronic systems that require substantial on-chip logic and I/O capacity. The device provides 67,200 logic elements, approximately 1.14688 Mbits of embedded memory, and 1,060 user I/Os in a 1508-BBGA FCBGA package.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this RoHS-compliant FPGA targets commercial designs that need dense programmable logic, significant embedded RAM, and very high I/O count in a surface-mount package.

Key Features

• Logic Capacity  Provides 67,200 logic elements (equivalent to approximately 5,250,000 gates) for implementing complex custom digital functions and state machines.
• Embedded Memory  Approximately 1.14688 Mbits of on-chip RAM for buffering, LUT-based storage, and local data handling without external memory.
• I/O Density  1,060 general-purpose I/Os to support multiple high-pin-count interfaces, parallel buses, and mixed-signal front-end connections.
• Package & Mounting  1508-BBGA (FCBGA) package; supplier device package listed as 1508-FBGA (40×40). Surface-mount construction for compact board integration.
• Power  Core supply voltage range of 1.425 V to 1.575 V to match target power architectures and regulator designs.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant to meet standard environmental and supply-chain requirements for commercial assemblies.

Typical Applications

• High-density digital systems  Implement wide datapaths, custom accelerators, and parallel processing logic using the device's 67,200 logic elements and large gate count.
• Memory-centric designs  Leverage approximately 1.14688 Mbits of embedded RAM for FIFOs, line buffers, and localized storage without immediate need for external RAM.
• Multi-interface controllers  Support complex system integration and protocol bridging with 1,060 I/Os for parallel buses, multiple serial lanes, and sensor/device connections.
• Compact surface-mount solutions  Deploy in space-constrained commercial products using the 1508-BBGA surface-mount package.

Unique Advantages

• Highly integrated solution: Consolidates large logic capacity, embedded RAM, and extensive I/O into a single FPGA package, reducing component count and board complexity.
• Substantial logic resources: 67,200 logic elements and an estimated 5.25 million gates enable implementation of complex digital subsystems on-chip.
• Large I/O complement: 1,060 I/Os accommodate multiple parallel interfaces and extensive peripheral connectivity without external expander chips.
• On-chip memory for local buffering: Approximately 1.14688 Mbits of embedded RAM supports data buffering, state storage, and temporary datasets close to logic for deterministic performance.
• Commercial-ready packaging and compliance: Surface-mount 1508-BBGA package and RoHS compliance simplify integration into commercial product workflows.

Why Choose EP2A70F1508C9?

The EP2A70F1508C9 positions itself as a high-density, commercially graded FPGA for designs that demand a large number of logic elements, considerable embedded memory, and very high I/O counts in a single, surface-mount package. Its supply voltage range and specified operating temperature make it suitable for standard commercial environments.

This FPGA is well suited for engineering teams building complex digital subsystems, protocol aggregation units, or memory-buffered processing elements who need to minimize external components while keeping board area compact. The combination of logic capacity, on-chip RAM, and I/O flexibility provides a scalable platform for evolving designs within commercial-product lifecycles.

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