EP2AGX125DF25C4

The EP2AGX125DF25C4 is an Arria II GX field-programmable gate array (FPGA) IC in a 572-ball FCBGA package. It provides a large pool of programmable logic, embedded RAM, and a high I/O count in a surface-mount footprint for commercial-grade applications.

This device is suited to designs that require substantial on-chip logic capacity, significant embedded memory, and a compact BGA package, with defined operating voltage and commercial temperature range.

Key Features

• Logic Capacity  Contains 118,143 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 8.316 Mbits of total on-chip RAM to support buffering, on-chip data storage, and algorithm acceleration.
• I/O Density  260 user I/Os to enable rich external interfacing and multiple parallel connections to peripherals and other system components.
• Package & Mounting  572-FBGA (FC, 25×25) package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply specified between 870 mV and 930 mV for defined power-domain design and planning.
• Commercial Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and lead-free manufacturing considerations.

Typical Applications

• High-performance data processing  Use the large logic fabric and embedded RAM to implement custom data-paths, signal processors, and packet-processing engines.
• I/O-intensive system interfacing  260 available I/Os allow integration with multiple sensors, controllers, or parallel data buses in space-constrained designs.
• Embedded control and custom logic  Leverage the programmable logic and on-chip memory for real-time control, state machines, and application-specific accelerators.

Unique Advantages

• Substantial programmable resources: 118,143 logic elements provide headroom for complex logic implementations and multi-function designs.
• Significant on-chip memory: Approximately 8.316 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs.
• High I/O count in a compact package: 260 I/Os in a 572-FBGA (25×25) package help minimize board area while maximizing connectivity.
• Defined power envelope: A specified core voltage range of 870–930 mV supports predictable power planning and design integration.
• Commercial-temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS compliance: Facilitates lead-free manufacturing and regulatory alignment.

Why Choose EP2AGX125DF25C4?

The EP2AGX125DF25C4 delivers a balance of large programmable logic capacity, substantial embedded memory, and high I/O density in a compact 572-FBGA package. As a commercial-grade Arria II GX device, it is documented within the Arria II device handbook for electrical characteristics and device-level specifications, enabling engineers to plan power, I/O, and thermal requirements with confidence.

This device is well suited to system designers and embedded engineers who need a programmable, high-capacity logic device for data processing, interface consolidation, and custom hardware acceleration—providing scalability and predictable integration for long-term projects.

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