EP2AGX125DF25C5G

The EP2AGX125DF25C5G is an Arria II GX field programmable gate array (FPGA) from Intel, provided in a 572-FBGA surface-mount package. It delivers a high count of programmable logic elements, substantial on-chip RAM, and a broad I/O complement for commercial embedded designs that require flexible hardware programmability and integration.

With approximately 118,143 logic elements, roughly 8.3 Mbits of embedded memory, 260 I/O pins, and a 0 °C to 85 °C commercial operating range, this device is suited to applications that need significant on-chip resources in a compact, RoHS-compliant package.

Key Features

• Core logic capacity  Approximately 118,143 logic elements to implement complex programmable logic and customized hardware functions.
• Embedded memory  Approximately 8.3 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to reduce external memory dependency.
• I/O density  260 I/O pins provide connectivity for multiple interfaces, peripherals, and board-level signals.
• Power  Supported supply voltage range of 870 mV to 930 mV to match low-voltage system domains.
• Package & mounting  572-FBGA, FC (25×25) surface-mount package for compact board integration and high pin density.
• Operating range & grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom digital logic and prototyping  Implement and iterate complex hardware functions and accelerators using the device’s large logic-element count and embedded memory.
• Multi‑interface I/O hubs  Leverage 260 I/Os to aggregate and manage signals from multiple peripherals and subsystems on a single FPGA.
• Memory‑intensive on-chip buffering  Use approximately 8.3 Mbits of embedded RAM for packet buffering, data staging, and temporary storage without immediate reliance on external memory.

Unique Advantages

• High integration in a single device: Approximately 118,143 logic elements and substantial on-chip RAM reduce the need for multiple discrete components.
• Compact, high‑density package: The 572-FBGA (25×25) surface-mount package enables dense PCB layouts while preserving a large I/O count.
• Broad I/O capability: 260 I/O pins support diverse interfacing and simplify system-level wiring and routing.
• Low-voltage compatibility: Operation between 870 mV and 930 mV aligns with modern low-voltage digital domains.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for commercial deployments.
• Manufacturer pedigree: Part of Intel’s Arria II GX family, offering documented specifications for design integration.

Why Choose EP2AGX125DF25C5G?

The EP2AGX125DF25C5G combines a high logic-element count, substantial embedded memory, and a large I/O complement in a compact 572-FBGA package—making it a strong fit for commercial applications that require dense programmable logic and on-chip data storage. Its low-voltage operation and RoHS compliance further support integration into modern, environmentally conscious designs.

This device is suited to engineers and teams building complex, customizable digital systems who need scalable logic capacity, significant on-chip RAM, and flexible I/O in a surface-mount FPGA package backed by the Arria II GX family documentation.

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