EP2AGX125DF25C6

The EP2AGX125DF25C6 is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 572-ball FCBGA package. This commercial‑grade FPGA integrates a large logic capacity and embedded memory to support complex, programmable digital designs.

Built as part of the Arria II GX device family, the device targets commercial embedded applications that require substantial on-chip logic, numerous I/O, and flexible board‑level integration.

Key Features

• Logic Capacity  Provides 118,143 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 8.32 Mbits of on‑chip RAM for data buffering, FIFOs, and local storage.
• I/O Resources  260 I/O pins to support wide external interfacing and multiple peripheral connections.
• Package and Mounting  572‑BGA, FCBGA package (supplier package: 572‑FBGA, FC (25×25)) with surface‑mount mounting for standard PCB assembly.
• Core Power Range  Specified core voltage supply range of 870 mV to 930 mV to meet device power requirements.
• Commercial Grade Temperature Range  Rated for operation from 0 °C to 85 °C for commercial environmental conditions.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density digital logic  Use the large logic element count to implement complex state machines, datapath logic, and custom accelerators in commercial systems.
• Embedded memory buffering  Leverage approximately 8.32 Mbits of on‑chip RAM for buffering, packet queuing, and local data storage.
• I/O‑intensive interfaces  260 I/O pins accommodate multi‑channel connectivity and board‑level interfacing requirements.

Unique Advantages

• Substantial programmable logic: The 118,143 logic elements enable implementation of feature‑rich FPGA designs without immediate migration to larger device families.
• Significant embedded memory: Approximately 8.32 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and local storage needs.
• Flexible board integration: The 572‑ball FCBGA (572‑FBGA, FC (25×25)) package and surface‑mount mounting support standard PCB assembly flows.
• Commercial operating range: Rated 0 °C to 85 °C and RoHS compliant, suitable for a wide range of commercial products and development platforms.
• Ample I/O count: 260 I/Os enable diverse peripheral and interface connections on a single device.

Why Choose EP2AGX125DF25C6?

The EP2AGX125DF25C6 positions itself as a commercial‑grade programmable logic device that balances high logic density, substantial embedded memory, and a large I/O complement in a standard FCBGA package. It is well suited for designers who need a single FPGA capable of accommodating complex logic functions and significant on‑chip buffering while integrating into common surface‑mount PCB assemblies.

For teams focused on commercial embedded systems that require scalable, reprogrammable hardware, this Arria II GX FPGA offers a practical combination of capacity and integration, backed by Intel’s Arria II device family documentation and specifications.

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