EP2AGX125DF25I3G

The EP2AGX125DF25I3G is an Intel Arria II GX field-programmable gate array supplied in a 572-FBGA (25×25) package for surface-mount applications. It provides a high logic element count and embedded memory capacity in an industrial-grade device with a broad operating temperature range.

This device targets designs that require substantial on-chip logic, plentiful I/O, and reliable operation across -40 °C to 100 °C, while operating from a core supply of 870 mV to 930 mV.

Key Features

• Logic Capacity — 118,143 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded Memory — Approximately 8.32 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage without external memory.
• I/O Density — 260 I/O pins to enable broad connectivity to peripherals, sensors, and external devices.
• Package and Mounting — 572-BGA (572-FBGA, FC 25×25) package in a surface-mount format for compact, board-level integration.
• Power — Core voltage range of 870 mV to 930 mV to match system power delivery and budgeting requirements.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to support demanding environmental conditions.
• RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Control — Industrial-grade operation and wide temperature range enable deployment in factory automation, motor control logic, and PLC systems.
• Embedded Systems — High logic density and on-chip memory support complex embedded designs and custom processing functions.
• Interface and I/O Aggregation — 260 I/O pins facilitate consolidation of multiple peripherals and high-pin-count interface bridging on a single device.

Unique Advantages

• High Logic Integration: 118,143 logic elements reduce the need for external glue logic and multiple discrete devices.
• Substantial On-Chip Memory: Approximately 8.32 Mbits of embedded RAM supports local buffering and logic-intensive functions without additional external memory.
• Robust Industrial Operation: Specified -40 °C to 100 °C operation and industrial grade rating provide reliability in harsh environments.
• Compact, High-Density Package: 572-FBGA (25×25) surface-mount package enables compact board layouts while offering extensive I/O.
• Low-Voltage Core Support: Core supply range of 870 mV to 930 mV aligns with modern power-optimized systems.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose EP2AGX125DF25I3G?

The EP2AGX125DF25I3G positions itself as a high-capacity, industrial-grade FPGA offering a combination of extensive logic resources, on-chip memory, and substantial I/O in a compact 572-FBGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-life embedded and industrial designs requiring dependable performance.

This device is well suited for engineering teams building systems that demand high logic integration, local memory resources, and flexible I/O routing while maintaining industrial temperature robustness and compact board integration.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP2AGX125DF25I3G. Our team can assist with technical and procurement details to support your design cycle.