EP2AGX125DF25I5G

The EP2AGX125DF25I5G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572‑ball FCBGA package for surface mount applications. It provides a combination of programmable logic, embedded memory and a high count of I/O for designs that require significant on‑chip resources and flexible interfacing.

With 118,143 logic elements, approximately 8.3 Mbits of embedded memory and 260 available I/Os, this device targets complex digital processing and I/O‑intensive applications that must operate across an industrial temperature range.

Key Features

• Programmable Logic 118,143 logic elements to implement custom digital logic, state machines and data-path functions.
• On‑Chip Memory Approximately 8.3 Mbits of embedded RAM for packet buffering, lookup tables and intermediate data storage.
• I/O Capacity 260 I/Os to support wide parallel interfaces, multiple serial/transceiver endpoints or mixed signal front ends.
• Power Supply Core voltage range of 870 mV–930 mV to match system power rails and enable stable operation within specified limits.
• Package & Mounting 572‑ball BGA (FCBGA, 25 × 25 mm) surface‑mount package for a compact, high‑density board footprint.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance RoHS compliant to meet common environmental and supply‑chain requirements.

Typical Applications

• Industrial Control & Automation Implement control logic, protocol bridging and real‑time I/O aggregation within industrial systems operating across extended temperatures.
• High‑Density Interface Aggregation Consolidate multiple parallel or serial interfaces using abundant I/O and programmable logic to simplify board-level design.
• Digital Signal Processing On‑chip logic and embedded memory support custom DSP pipelines, buffering and preprocessing tasks.
• Embedded System Integration Act as a programmable glue logic and hardware accelerator to offload tasks from processors and reduce overall BOM complexity.

Unique Advantages

• Substantial Logic Capacity: 118,143 logic elements enable large custom designs without immediate migration to higher‑capacity devices.
• Significant On‑Chip Memory: Approximately 8.3 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state storage.
• High I/O Count: 260 I/Os allow flexible connectivity options and support for wide data buses or multiple endpoint interfaces.
• Industrial Temperature Operation: −40 °C to 100 °C operating range supports deployment in harsh or temperature‑variable environments.
• Compact BGA Packaging: 572‑ball FCBGA (25 × 25 mm) provides a high‑density solution for space‑constrained PCBs while maintaining robust solder mounting.
• Regulatory Readiness: RoHS compliance supports streamlined integration into environmentally regulated product lines.

Why Choose EP2AGX125DF25I5G?

The EP2AGX125DF25I5G positions itself as a capable mid‑to‑high density Arria II GX FPGA option for designers who need a balance of programmable logic, embedded memory and extensive I/O in a compact, surface‑mount BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for demanding electronic systems that require reliable operation across wide temperature ranges.

This device is well suited to development teams designing complex digital systems, interface bridges, or embedded accelerators that benefit from on‑chip resources and flexible I/O. Its specifications support scalable implementations and long‑term deployment where robustness and predictable electrical requirements are important.

Request a quote or submit an RFQ for pricing and availability of EP2AGX125DF25I5G to evaluate suitability for your next design.