EP2AGX125EF29C4

The EP2AGX125EF29C4 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers a high-density programmable fabric with 118,143 logic elements and substantial on-chip RAM to address complex digital logic and memory‑heavy designs.

Designed for commercial-grade applications, the device combines a large I/O count and a compact surface-mount 780-FBGA (29 × 29 mm) package, with a documented core supply range of 870 mV to 930 mV and an operating temperature of 0 °C to 85 °C.

Key Features

• High-density logic — 118,143 logic elements provide capacity for complex combinational and sequential designs.
• Embedded memory — Approximately 8.316 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• High I/O count — 372 user I/Os for broad interface flexibility and multi‑lane connectivity.
• Package and mounting — 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29 × 29 mm) optimized for surface-mount assembly.
• Power rails — Core voltage supply specified from 870 mV to 930 mV for precise power sequencing and budgeting.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C, suitable for commercial‑class environments.
• RoHS compliant — Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.
• Documented device family characteristics — The Arria II device handbook provides electrical and switching characteristics for the Arria II family, including core and I/O timing guidance.

Typical Applications

• High-density digital processing — Use the large logic element count and on-chip RAM for signal processing, data path implementation, and custom accelerators.
• Interface aggregation and bridging — 372 I/Os enable complex multi‑interface designs and high‑pin‑count connectivity tasks.
• Prototyping and system integration — Surface-mount 780-FBGA packaging supports compact board designs for development and integration into commercial products.

Unique Advantages

• Substantial programmable capacity: 118,143 logic elements allow integration of sizable custom logic blocks without partitioning across multiple devices.
• Embedded memory on-chip: Approximately 8.316 Mbits of RAM reduces external memory needs for many buffering and state‑storage functions.
• Flexible I/O resources: 372 I/Os provide design flexibility for parallel interfaces, GPIO, and multi‑lane connectivity within a single device.
• Compact, production-ready package: The 780-FBGA (29 × 29 mm) surface-mount package supports high-density board layouts while maintaining manufacturability.
• Commercial operating range: Rated from 0 °C to 85 °C for applications targeting commercial environments and standard operating conditions.
• RoHS compliance: Supports lead‑free manufacturing processes and environmental regulatory requirements.

Why Choose EP2AGX125EF29C4?

The EP2AGX125EF29C4 provides a balanced combination of large programmable logic capacity, meaningful on‑chip memory, and a high I/O count in a compact 780-FBGA surface‑mount package. Its documented electrical characteristics and commercial temperature rating make it a suitable choice for development and deployment in commercial embedded and signal-processing systems that require significant on-chip resources.

Engineers and procurement teams seeking a commercial-grade Arria II GX FPGA with clear power and thermal limits, a dense logic fabric, and extensive I/O will find this device appropriate for consolidating multiple functions into a single, manufacturable component.

Request a quote or submit an RFQ to receive pricing, availability, and lead-time information for EP2AGX125EF29C4.