EP2AGX125DF25I5

The EP2AGX125DF25I5 is an Intel Arria II GX field programmable gate array (FPGA) offered in a 572-ball FCBGA package for surface-mount applications. It provides a high logic capacity and embedded memory footprint suited to designs that require flexible programmable logic, substantial on-chip RAM, and a large I/O complement.

With industrial-grade qualification and a broad operating temperature range, this device is targeted at applications that demand robust operation across harsh environments while maintaining the integration advantages of a programmable logic device.

Key Features

• Logic Capacity — 118,143 logic elements (cells) to implement complex digital functions and custom datapaths.
• Embedded Memory — Approximately 8.3 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Resources — 260 I/O pins to support extensive peripheral connectivity and multi-interface designs.
• Package & Mounting — 572-BGA (572-FBGA, FC) package in a 25 × 25 mm footprint; surface mount for PCB integration.
• Power — Core supply operating range of 870 mV to 930 mV to match system power rail planning.
• Operating Temperature — Rated for −40 °C to 100 °C to meet industrial thermal requirements.
• Industrial Grade — Device grade listed as Industrial for applications requiring extended environmental tolerance.
• Compliance — RoHS compliant.

Typical Applications

• High-speed communications and networking — Use the device where transceiver performance and programmable I/O are required for protocol handling and data routing.
• Embedded signal processing — Leverage the large logic fabric and embedded RAM for FPGA-based DSP, packet processing, and real-time data manipulation.
• Interface bridging and protocol offload — 260 I/Os enable protocol conversion and offloading of host processors in multi-interface systems.
• Industrial control and instrumentation — Industrial-grade rating and wide temperature range support deployment in factory automation and process control environments.

Unique Advantages

• Substantial logic density: 118,143 logic elements provide the headroom to implement large, complex designs without external logic expansion.
• Significant on-chip memory: Approximately 8.3 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level design.
• Broad I/O capability: 260 I/Os allow flexible interfacing to sensors, processors, high-speed PHYs, and peripheral devices.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C for reliable operation across demanding environmental conditions.
• Compact, manufacturable package: 572-FBGA (25 × 25 mm) surface-mount package supports high-density PCB layouts while maintaining manufacturability.
• Regulatory compliance: RoHS compliance supports modern product sustainability and regulatory requirements.

Why Choose EP2AGX125DF25I5?

The EP2AGX125DF25I5 balances high logic capacity, substantial embedded memory, and a large I/O complement in a compact 572-FBGA package, making it well suited for industrial and communications-oriented FPGA designs. Its specified core voltage range and industrial operating temperature rating provide a clear basis for system-level power and thermal planning.

This device is appropriate for engineering teams and procurement seeking a robust, Intel Arria II GX family FPGA that delivers integration and flexibility for demanding system designs while adhering to RoHS requirements.

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