EP2AGX125DF25I3

The EP2AGX125DF25I3 is an Arria II GX family FPGA offering a programmable logic fabric with 118,143 logic elements and approximately 8.32 Mbits of embedded memory. Packaged in a 572-ball FCBGA (25×25) surface-mount package and rated for industrial operation, it targets designs that require dense logic capacity, significant on-chip RAM, and a large I/O complement.

As a member of the Arria II GX device family, the device is aligned with the familyʼs documented electrical and transceiver capabilities and is specified for industrial temperature ranges and constrained core supply operation.

Key Features

• Logic Capacity – 118,143 logic elements (cells) providing a substantial amount of programmable logic for complex designs.
• Embedded Memory – Approximately 8.32 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density – 260 user I/Os to support wide parallel buses and multiple peripheral interfaces.
• Package & Mounting – 572-ball FCBGA (572-FBGA, FC 25×25) surface-mount package for compact, high-density PCB implementations.
• Industrial Grade & Temperature Range – Specified for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Core Voltage Range – Core supply defined between 870 mV and 930 mV to meet Arria II GX family power requirements.
• Family Features – As part of the Arria II GX series, the device is documented alongside transceiver performance specifications and PCI Express (PIPE) HIP block references in the device handbook.
• Regulatory Compliance – RoHS compliant.

Typical Applications

• Industrial Control Systems – Industrial-grade temperature rating and extensive I/O make the device suitable for factory automation and motion-control logic.
• Platform and Prototyping – Large logic element count and on-chip RAM enable hardware prototyping and platform designs that require flexible logic partitioning.
• Data Buffering and Packet Processing – Significant embedded memory supports buffering and intermediate data storage for streaming or packet-based systems.

Unique Advantages

• High Logic Integration: 118,143 logic elements allow complex functions and large finite-state machines to be implemented on a single device, reducing board-level component count.
• Substantial On‑Chip Memory: Approximately 8.32 Mbits of embedded RAM minimizes external memory dependencies and simplifies bus timing.
• Ample I/O Count: 260 I/Os support broad peripheral connectivity and parallel interface requirements without additional I/O expanders.
• Industrial Thermal Capability: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact BGA Package: 572-ball FCBGA (25×25) offers a space-efficient form factor for dense PCB designs while maintaining high pin count.
• Family-Level Connectivity Features: Documentation for the Arria II GX family includes transceiver and PCI Express (PIPE) HIP block details to support high-speed interface planning.

Why Choose EP2AGX125DF25I3?

The EP2AGX125DF25I3 positions itself as a high-capacity, industrial-grade member of the Arria II GX family, combining a large logic fabric, significant embedded memory, and a broad I/O set in a compact FCBGA package. Its specified core voltage range and family-level documentation make it suitable for designs that require predictable power domains and documented transceiver/interface considerations.

This device is appropriate for engineering teams and procurement looking for a single-FPGA solution that balances logic density, on-chip RAM, and industrial temperature capability while maintaining a compact PCB footprint.

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