EP2AGX125DF25C6N

The EP2AGX125DF25C6N is an Arria II GX family FPGA in a 572-ball FCBGA package, manufactured by Intel. It provides a high-count programmable logic fabric with large on-chip memory and a substantial I/O complement for complex board-level designs.

Designed for commercial-grade applications, this device combines 118,143 logic elements, approximately 8.32 Mbits of embedded memory, and 260 user I/O to support high-density, configurable digital logic and system integration within a compact surface-mount footprint.

Key Features

• Programmable Logic  118,143 logic elements and 4,964 logic blocks provide a substantial fabric for implementing complex digital functions and custom architectures.
• Embedded Memory  Approximately 8.32 Mbits of on-chip RAM to support buffering, packet storage, and on-chip data structures without external memory in many use cases.
• I/O Capacity  260 user I/O pins for multi-interface connectivity and high-pin-count subsystem integration.
• Power and Core Supply  Core supply range specified at 870 mV to 930 mV to match low-voltage core power requirements.
• Package and Mounting  Available in a 572-ball BGA (FCBGA) package; supplier device package listed as 572-FBGA, FC (25×25). Surface-mount mounting type for standard PCB assembly flows.
• Commercial Grade & Temperature Range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Suitable for implementations that require large programmable logic capacity and significant on-chip memory.
• Multi-interface control  High I/O count enables consolidation of multiple interfaces and peripheral controls on a single FPGA.
• Compact board-level integration  572-ball FCBGA surface-mount package supports compact, high-density PCB designs.

Unique Advantages

• High integration density: 118,143 logic elements and 4,964 logic blocks reduce the need for external glue logic and simplify system architecture.
• Substantial on-chip memory: Approximately 8.32 Mbits of embedded RAM enables local buffering and data handling without immediate dependence on external memory.
• Generous I/O resource: 260 I/O pins support connections to multiple peripherals, interfaces, and board-level subsystems.
• Compact surface-mount package: 572-ball FCBGA (25×25) provides a high pin-density solution suitable for space-constrained PCBs.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with low-voltage power architectures for modern FPGA cores.

Why Choose EP2AGX125DF25C6N?

The EP2AGX125DF25C6N positions itself as a high-density, commercially rated Arria II GX FPGA option that blends a large logic fabric, meaningful on-chip memory, and a high I/O count in a compact 572-ball FCBGA package. These attributes make it well suited for designers who need to consolidate complex digital functions, support multi-interface systems, and optimize board-level space.

With RoHS compliance and a defined commercial operating range, the device offers predictable electrical and thermal characteristics for mainstream embedded and system designs where integration density and predictable on-board implementation are priorities.

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