EP2AGX125DF25C6G

IC FPGA 260 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 260 8315904 118143 572-BGA, FCBGA

Quantity 1,712 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O260Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4964Number of Logic Elements/Cells118143
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits8315904

Overview of EP2AGX125DF25C6G – Arria II GX FPGA, 118,143 Logic Elements, 572-FBGA

The EP2AGX125DF25C6G is an Arria II GX field programmable gate array (FPGA) manufactured by Intel. It provides a high logic capacity FPGA in a compact 572-FBGA surface-mount package suitable for commercial-grade designs.

Key device attributes include 118,143 logic elements, approximately 8.3 Mbits of embedded RAM, 260 user I/Os, a low-voltage supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core / Logic Capacity — 118,143 logic elements to support complex programmable logic implementations.
  • Embedded Memory — Approximately 8.3 Mbits of on-chip RAM for buffering, state storage, and local data processing.
  • I/O Count — 260 user I/Os providing a broad set of external interface options.
  • Power — Specified voltage supply range of 870 mV to 930 mV for core power planning.
  • Package & Mounting — 572-BGA (572-FBGA, 25×25) surface-mount package for high-density board integration.
  • Operating Conditions & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 118,143 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
  • Substantial on-chip memory: Approximately 8.3 Mbits of embedded RAM supports local buffering and memory-intensive logic without external memory for certain use cases.
  • Generous I/O resources: 260 user I/Os allow flexible interfacing to peripherals, sensors, and external logic.
  • Compact BGA packaging: 572-FBGA (25×25) surface-mount package delivers a small footprint for dense PCB layouts.
  • Low-voltage core operation: 870 mV to 930 mV supply range supports low-voltage system architectures and careful power budgeting.
  • Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet typical commercial application temperature requirements.

Why Choose EP2AGX125DF25C6G?

The EP2AGX125DF25C6G is positioned for designs that require a high count of programmable logic elements, substantial embedded RAM, and a large I/O complement within a compact 572-FBGA surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of standard commercial applications.

Manufactured by Intel as part of the Arria II GX family, this device is a choice when designers need to integrate dense logic and memory resources while maintaining a compact board footprint and defined power and temperature specifications.

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