EP2AGX125DF25C6G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 260 8315904 118143 572-BGA, FCBGA |
|---|---|
| Quantity | 1,712 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 260 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4964 | Number of Logic Elements/Cells | 118143 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8315904 |
Overview of EP2AGX125DF25C6G – Arria II GX FPGA, 118,143 Logic Elements, 572-FBGA
The EP2AGX125DF25C6G is an Arria II GX field programmable gate array (FPGA) manufactured by Intel. It provides a high logic capacity FPGA in a compact 572-FBGA surface-mount package suitable for commercial-grade designs.
Key device attributes include 118,143 logic elements, approximately 8.3 Mbits of embedded RAM, 260 user I/Os, a low-voltage supply range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core / Logic Capacity — 118,143 logic elements to support complex programmable logic implementations.
- Embedded Memory — Approximately 8.3 Mbits of on-chip RAM for buffering, state storage, and local data processing.
- I/O Count — 260 user I/Os providing a broad set of external interface options.
- Power — Specified voltage supply range of 870 mV to 930 mV for core power planning.
- Package & Mounting — 572-BGA (572-FBGA, 25×25) surface-mount package for high-density board integration.
- Operating Conditions & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 118,143 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
- Substantial on-chip memory: Approximately 8.3 Mbits of embedded RAM supports local buffering and memory-intensive logic without external memory for certain use cases.
- Generous I/O resources: 260 user I/Os allow flexible interfacing to peripherals, sensors, and external logic.
- Compact BGA packaging: 572-FBGA (25×25) surface-mount package delivers a small footprint for dense PCB layouts.
- Low-voltage core operation: 870 mV to 930 mV supply range supports low-voltage system architectures and careful power budgeting.
- Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet typical commercial application temperature requirements.
Why Choose EP2AGX125DF25C6G?
The EP2AGX125DF25C6G is positioned for designs that require a high count of programmable logic elements, substantial embedded RAM, and a large I/O complement within a compact 572-FBGA surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of standard commercial applications.
Manufactured by Intel as part of the Arria II GX family, this device is a choice when designers need to integrate dense logic and memory resources while maintaining a compact board footprint and defined power and temperature specifications.
Request a quote for EP2AGX125DF25C6G to check availability and pricing or to submit a purchase inquiry.

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