EP2AGX125DF25C5

The EP2AGX125DF25C5 is an Arria II GX-class field programmable gate array from Intel, delivered in a 572-BGA FCBGA package for surface-mount assembly. As a reconfigurable logic device, it provides a combination of large logic capacity, substantial on-chip memory, and high I/O count suited to commercial electronic designs that require flexible, programmable digital logic.

Core operating characteristics and device electrical guidelines are documented in the Arria II device handbook and device datasheet, which detail operating conditions, switching characteristics, and I/O timing.

Key Features

• Logic Capacity — 118,143 logic elements to support complex custom digital functions and parallel processing architectures.
• Logic Array Blocks — 4,964 logic array blocks for structured logic placement and routing.
• Embedded Memory — Approximately 8.32 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive logic.
• I/O Density — 260 I/O pins to connect diverse peripherals and subsystems without external multiplexing.
• Core Voltage — Specified operating supply range of 0.87 V to 0.93 V for the device core.
• Package & Mounting — 572-BGA, FCBGA package (supplier package: 572-FBGA, FC (25x25)) in a surface-mount form factor for compact board integration.
• Commercial Grade — Rated for 0 °C to 85 °C operation for commercial-temperature applications.
• Regulatory — RoHS compliant, meeting common environmental requirements for commercial electronics.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex digital designs using the device’s large logic element pool and abundant routing resources.
• Embedded memory-centric designs — Use the device’s approximately 8.32 Mbits of on-chip RAM for buffering, packet processing, or temporary data storage without needing external RAM for many functions.
• High-density I/O control — Integrate multiple peripherals and I/O buses directly to the FPGA using 260 I/O pins to reduce external interface components.
• Commercial electronics platforms — Suitable for product development and deployment within the commercial temperature range, leveraging surface-mount packaging for compact board layouts.

Unique Advantages

• Substantial logic resources: 118,143 logic elements enable significant integration of custom logic, consolidating multiple functions into a single device.
• On-chip memory capacity: Approximately 8.32 Mbits of embedded RAM reduces dependency on external memory for many buffering and data-path needs.
• High I/O count: 260 I/Os allow direct connection of numerous peripherals and interfaces, simplifying board-level design.
• Compact, manufacturable package: 572-BGA FCBGA in a surface-mount format supports dense, production-ready PCB layouts.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for widespread commercial deployments.
• Documented device characteristics: Device electrical and switching characteristics are provided in the Arria II device handbook and device datasheet for design and validation.

Why Choose EP2AGX125DF25C5?

The EP2AGX125DF25C5 offers a balance of high logic capacity, meaningful on-chip memory, and substantial I/O in a compact surface-mount BGA package, making it appropriate for commercial electronic designs that require integrated, reprogrammable logic. Its documented electrical characteristics and commercial operating range support predictable integration into production hardware.

This device is well suited to designers and teams looking to consolidate digital functions, implement custom processing pipelines, or develop high-density I/O systems while retaining the flexibility inherent to FPGAs.

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