EP2AGX125DF25C4G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 260 8315904 118143 572-BGA, FCBGA |
|---|---|
| Quantity | 1,244 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 260 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4964 | Number of Logic Elements/Cells | 118143 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8315904 |
Overview of EP2AGX125DF25C4G – Arria II GX Field Programmable Gate Array (FPGA), 572‑BGA (FCBGA)
The EP2AGX125DF25C4G is an Intel Arria II GX FPGA featuring a 40‑nm low‑power programmable logic engine and streamlined transceivers and I/Os. It is supplied in a 572‑ball FCBGA (25×25) surface‑mount package and is targeted at commercial applications that require high logic density, embedded memory, and multi‑gigabit serial connectivity.
Designed for designs with high‑bandwidth interfaces and DSP requirements, the device supports common system interfaces and development flows described for the Arria II family, enabling implementation of PCIe, Ethernet, DDR3 memory interfaces and a variety of serial protocols using provided design tools and IP.
Key Features
- Core Logic — 118,143 logic elements to implement complex programmable logic and control functions.
- Embedded Memory — Approximately 8.3 Mbits of on‑chip RAM (Total Ram Bits: 8,315,904) for buffering, FIFOs and local storage.
- I/O and Packaging — 260 user I/O pins in a 572‑BGA FCBGA (25×25) package; surface mount for compact system integration.
- High‑Speed Transceivers & Interfaces — Arria II GX family transceiver architecture supports multi‑gigabit links and common protocols used in networking and communications, with family references to transceiver operation up to 6.375 Gbps.
- DSP and Arithmetic Resources — Family DSP blocks and configurable multipliers and accumulators provide dedicated hardware for signal processing workloads (datasheet documents DSP blocks and multiplier configurations).
- Power — Low‑voltage core supply range from 870 mV to 930 mV consistent with the Arria II low‑power 40‑nm architecture.
- Operating Conditions & Compliance — Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High‑Speed Networking & Telecom — Implement Ethernet, PCIe and other serial protocols using the device’s transceiver capability and protocol support from the Arria II family.
- Signal Processing & DSP — Use integrated DSP blocks and on‑chip memory for real‑time filtering, encoding/decoding and baseband processing.
- Storage & Host Interfaces — Support host interface functions and storage protocols where multi‑gigabit SERDES and programmable logic accelerate data paths.
- High‑Bandwidth Embedded Systems — Apply the device where dense logic, embedded RAM and high I/O count are required for custom control, packet handling or data aggregation.
Unique Advantages
- High Logic Density: 118,143 logic elements provide capacity for large, integrated FPGA designs without immediate need for external logic.
- Integrated Memory Resources: Approximately 8.3 Mbits of embedded RAM allow local buffering and efficient implementation of FIFOs and state machines.
- Multi‑Gigabit Serial Support: Arria II GX family transceiver architecture supports a broad set of serial protocols and link rates up to the family’s documented limits, enabling flexible high‑speed I/O designs.
- Dedicated DSP Capabilities: Family DSP blocks and configurable multipliers reduce the need for external DSP ASICs in signal processing applications.
- Compact, Production‑Ready Package: 572‑ball FCBGA (25×25) surface‑mount package simplifies board layout for high‑I/O systems while meeting commercial product assembly requirements.
- Design Ecosystem: The Arria II family references an integrated design flow and IP solutions to accelerate implementation of common interfaces such as PCIe, Ethernet and DDR3.
Why Choose EP2AGX125DF25C4G?
The EP2AGX125DF25C4G positions itself as a commercial‑grade FPGA option for designs that require substantial logic capacity, embedded memory, and multi‑gigabit interface support in a compact FCBGA package. It leverages the Arria II GX family architecture and associated design flows to simplify implementation of high‑bandwidth system interfaces and DSP functions.
This device is suited to engineers and teams building networking, communications, storage and high‑bandwidth embedded systems who need a balance of logic density, on‑chip memory and transceiver capability, backed by the Arria II family design resources and IP referenced in the device documentation.
Request a quote or submit an inquiry for pricing and availability of EP2AGX125DF25C4G to move your design forward.

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