EP2AGX125DF25C4N

The EP2AGX125DF25C4N is an Intel Arria II GX family FPGA supplied in a 572-ball FCBGA package for surface-mount assembly. It is a commercial-grade programmable logic device intended for designs that require significant logic capacity, embedded memory, and a high number of I/O signals.

Device-level specifications include core voltage operating range, operating temperature range, and RoHS compliance, enabling integration into commercial electronic systems that need on-chip logic, memory, and connectivity resources within a compact ball-grid package.

Key Features

• Core Logic — 118,143 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory — Approximately 8.316 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Resources — 260 user I/O pins to accommodate diverse interfacing and bus requirements.
• Package & Mounting — 572-ball BGA (FCBGA) in a 25 × 25 mm supplier package footprint; surface-mount mounting for PCB assembly.
• Power — Core supply voltage rated from 870 mV to 930 mV, enabling predictable core power planning.
• Operating Conditions — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant for reduced-hazard material requirements.
• Family-Level Documentation — Arria II device handbook and datasheet content cover electrical characteristics and switching behavior, including transceiver and I/O timing information for the Arria II GX family.

Typical Applications

• Commercial systems requiring programmable logic — Deploys FPGA resources for custom digital functions in commercial electronic products operating within 0 °C to 85 °C.
• High-density logic and memory integration — Uses substantial logic element count and embedded RAM for designs that consolidate functionality onto a single device.
• Connectivity and I/O aggregation — High pin count supports complex interfacing and multiple parallel or serial I/O requirements in commercial designs.

Unique Advantages

• High logic capacity: 118,143 logic elements enable large-scale digital designs without immediately resorting to multi-FPGA architectures.
• Significant on-chip memory: Approximately 8.316 Mbits of embedded RAM reduces external memory dependency for many buffering and data-path needs.
• Generous I/O count: 260 I/O pins provide flexibility for interfacing multiple peripherals, buses, and external devices.
• Compact BGA package: 572-ball FCBGA in a 25 × 25 mm footprint maximizes gate density while keeping board area manageable.
• Commercial grade and RoHS compliant: Designed for standard commercial temperature ranges with material compliance for global manufacturing requirements.
• Documented device family behavior: Arria II GX family datasheet material is available covering electrical, switching, and I/O timing characteristics useful for system-level design and verification.

Why Choose EP2AGX125DF25C4N?

The EP2AGX125DF25C4N positions itself as a high-capacity, commercially graded Arria II GX FPGA suited to designs that need substantial programmable logic, embedded RAM, and a broad set of I/O in a compact BGA package. Its defined voltage and temperature ranges make it straightforward to plan power and thermal budgets for commercial products.

This device is appropriate for engineering teams consolidating digital functions onto a single FPGA, implementing complex data paths, or building systems that leverage the Arria II GX family documentation for electrical and I/O behavior during development and validation.

If you would like pricing, availability, or to request a formal quote for EP2AGX125DF25C4N, please submit a quote request or contact sales to begin the procurement process.