EP2AGX125DF25C5N

The EP2AGX125DF25C5N is an Arria II GX family FPGA packaged in a 572-ball FCBGA for surface-mount assembly. It delivers high logic density—118,143 logic elements—paired with substantial on-chip memory and a broad I/O count to support complex, integrated digital designs.

Designed for commercial-grade applications, this device combines substantial embedded memory (approximately 8.316 Mbits), 260 I/Os, and a low-voltage core supply range (870 mV–930 mV), making it suitable for system-level integration where logic capacity, memory and flexible interfacing are primary considerations.

Key Features

• Core Logic  118,143 logic elements provide large-scale programmable logic capacity for complex functions and custom hardware acceleration.
• Embedded Memory  Approximately 8.316 Mbits of on-chip RAM for buffering, state storage, and local data processing without immediate need for external memory.
• I/O Count  260 general-purpose I/Os enable flexible interfacing to peripherals, mezzanine modules, and system buses.
• Power and Voltage  Core supply requirement specified between 870 mV and 930 mV for compatibility with low-voltage power architectures.
• Package and Mounting  572-ball BGA (FCBGA), 25 × 25 mm supplier package; surface-mount package suitable for compact board layouts.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, aligning with commercial applications and environments.
• Standards Compliance  RoHS-compliant to meet environmental restriction requirements for lead-free assemblies.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory for custom signal processing, algorithm acceleration, and complex state machines.
• Prototyping and hardware validation  The FPGA’s capacity and I/O resources make it suitable for developing and validating system-level designs before ASIC migration.
• Interface consolidation  260 I/Os enable consolidation of multiple peripheral interfaces and protocol bridging on a single device.
• Embedded buffering and local storage  On-chip RAM supports packet buffering, temporary storage and local data handling to reduce reliance on external memory in many designs.

Unique Advantages

• Highly integrated logic and memory: Large logic element count combined with ~8.316 Mbits of embedded RAM reduces the need for external components and simplifies board-level design.
• Flexible system I/O: 260 I/Os provide capacity for multi-interface systems, minimizing additional interface chips and connectors.
• Compact BGA package: 572-ball FCBGA in a 25 × 25 mm footprint supports high-density PCB layouts for space-constrained applications.
• Low-voltage core operation: 870 mV–930 mV core supply range supports modern low-power power rails and efficient power-supply design.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS-compliant: Conforms to environmental lead-free requirements for contemporary manufacturing processes.

Why Choose EP2AGX125DF25C5N?

The EP2AGX125DF25C5N positions itself as a high-capacity programmable logic device for designers who need significant on-chip logic and memory along with broad I/O flexibility in a compact BGA package. Its combination of 118,143 logic elements, substantial embedded RAM, and 260 I/Os supports integration of complex functions and interface consolidation while keeping board-level component counts manageable.

This commercial-grade Arria II GX device is suitable for engineering teams focused on prototyping, system integration, and applications that require large programmable logic fabrics with local memory resources. The voltage and thermal specifications make it compatible with modern low-voltage power architectures and typical commercial operating environments.

Request a quote or submit an RFQ to secure pricing and availability for EP2AGX125DF25C5N for your next design.