EP2AGX125DF25I3N

The EP2AGX125DF25I3N is an Arria II GX field programmable gate array (FPGA) offered in an industrial-grade 572‑ball FCBGA package. It provides a high-density programmable logic fabric with an extended operating temperature range and a compact surface‑mount package suitable for space-constrained, industrial systems.

With a large logic capacity and multi-megabit on‑chip memory, this device addresses designs that require substantial programmable logic, embedded RAM, and a sizable complement of I/O in a single, RoHS‑compliant component.

Key Features

• High Logic Capacity – 118,143 logic elements supported by 4,964 configurable logic array blocks (CLBs) to implement complex logic and state machines.
• Embedded Memory – Approximately 8.3 Mbits of embedded RAM for buffering, lookup tables, and intermediate data storage.
• I/O Resources – 260 user I/O pins to interface with peripherals, sensors, and external memory or transceivers.
• Package & Mounting – 572‑ball FCBGA (572‑FBGA, FC; 25 × 25 mm) surface‑mount package for high‑density board integration.
• Industrial Grade & Temperature Range – Rated for industrial use with an operating temperature range of −40 °C to 100 °C.
• Core Voltage – Core supply operating range: 0.87–0.93 V, supporting low‑voltage core designs.
• Regulatory Compliance – RoHS‑compliant component suitable for lead‑free manufacturing.

Typical Applications

• Industrial Control & Automation – Industrial grade rating and −40 °C to 100 °C operation make the device suitable for factory automation, PLCs, and motion control systems.
• Communications & Infrastructure – High logic density and multi‑Mbit embedded memory provide the resources needed for packet processing, protocol handling, and interface bridging.
• High‑Density Embedded Systems – Compact 25 × 25 mm FCBGA package and abundant I/O support space‑constrained boards that require significant programmable logic.
• Prototype and OEM Designs – Flexible logic and memory resources enable rapid development and integration into production designs requiring long‑term industrial reliability.

Unique Advantages

• Substantial On‑Chip Resources: 118,143 logic elements and ~8.3 Mbits of embedded RAM reduce dependence on external logic and memory, simplifying BOM and board routing.
• Robust Industrial Operation: Industrial grade construction and a −40 °C to 100 °C operating window support deployment in demanding environments.
• High I/O Count: 260 I/O pins enable flexible interfacing with a wide range of peripherals and system components without extensive external circuitry.
• Compact, Manufacturable Package: 572‑FBGA (25 × 25 mm) surface‑mount package offers high pin density in a compact footprint for modern PCB assemblies.
• Power‑Efficient Core Range: Core voltage range of 0.87–0.93 V supports low‑voltage system designs and power management strategies.
• RoHS Compliance: Meets lead‑free manufacturing requirements for global production and regulatory consistency.

Why Choose EP2AGX125DF25I3N?

The EP2AGX125DF25I3N combines large programmable logic capacity, multi‑megabit embedded memory, and a high I/O count in a compact industrial FCBGA package. It is positioned for engineers who need substantial on‑chip resources and industrial temperature support for robust embedded and infrastructure designs.

This device suits development and production projects that demand scalability, reliable operation across wide temperature ranges, and integration into compact PCBs while maintaining compliance with RoHS manufacturing standards.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the EP2AGX125DF25I3N. Our team can assist with lead times and production‑level supply details.