EP2AGX125DF25I5N

The EP2AGX125DF25I5N is an Intel Arria II GX field-programmable gate array (FPGA) supplied in a 572-ball FCBGA package. It provides programmable logic resources, embedded memory, and extensive I/O connectivity targeted at industrial applications that require configurable hardware logic and on-chip memory.

Documented as part of the Arria II device family, the device is offered with industrial-grade operating characteristics and detailed electrical and switching specifications in the Arria II device handbook and device datasheet.

Key Features

• Logic Capacity — 118,143 logic elements (LEs) to implement complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 8.3 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources — 260 I/O pins to support broad external device and subsystem interfacing.
• Package and Mounting — 572-BGA FCBGA package (572-FBGA, FC 25×25) with surface-mount assembly for high-density board designs.
• Core Voltage — Core supply range of 870 mV to 930 mV, enabling defined power and performance operating points.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets restricted substances requirements for compliant manufacturing.

Typical Applications

• Industrial Control — Implement custom control logic, motor drives, and deterministic I/O processing in industrial automation systems where industrial-grade components are required.
• High-density I/O Systems — Aggregate and preprocess signals from multiple sensors or peripherals using the device’s 260 I/O pins and large logic capacity.
• Embedded Acceleration — Offload specialized data-paths or real-time processing tasks to the FPGA fabric using available logic elements and on-chip RAM.
• High-speed Serial/Interface Blocks — Use Arria II GX family transceiver and interface capabilities (as documented in the device handbook) for systems requiring structured high-speed communications and protocol support.

Unique Advantages

• Substantial Logic Resources: 118,143 logic elements provide headroom for complex custom logic and multi-function designs, reducing the need for multiple discrete logic devices.
• On-chip Memory: Approximately 8.3 Mbits of embedded RAM supports buffering, FIFOs, and memory-intensive accelerator functions without external memory.
• Extensive I/O Connectivity: 260 I/Os enable integration with a wide range of peripherals and sensors, simplifying board-level routing and subsystem consolidation.
• Industrial Ready: Rated for −40 °C to 100 °C operation and supplied in an industry-standard FCBGA package suitable for industrial applications.
• Defined Power Envelope: Core supply window of 870 mV to 930 mV provides a clear operating range for power budgeting and thermal design.
• Standards-aligned Documentation: Backed by the Arria II device handbook and device datasheet for electrical characteristics, transceiver specifications, and I/O timing guidance.

Why Choose EP2AGX125DF25I5N?

The EP2AGX125DF25I5N combines a large logic fabric with significant embedded memory and broad I/O in a compact 572-BGA FCBGA package, making it suitable for industrial-class programmable designs that require both density and on-board memory. Its documented operating voltage and industrial temperature rating support predictable integration into systems where reliability and specified operating conditions matter.

Engineers specifying this Arria II GX device benefit from detailed device-level documentation and a design footprint that consolidates programmable logic, memory, and I/O, enabling streamlined BOMs and reduced board complexity for industrial applications.

Request a quote or submit a sales inquiry to source EP2AGX125DF25I5N for your next industrial FPGA design.