EP2AGX125EF29C4N

The EP2AGX125EF29C4N is an Arria II GX field programmable gate array (FPGA) IC from Intel offered in a 780‑BBGA FCBGA package. It provides a high‑density programmable fabric with on‑chip embedded memory and a substantial I/O count for applications that require flexible logic implementation and extensive I/O connectivity.

Documentation for the Arria II device family describes transceiver performance, core and periphery performance, and programmable I/O timing, making this device suitable for designs that leverage those documented capabilities alongside the device’s logic, memory, and I/O resources.

Key Features

• Logic Capacity  Approximately 118,143 logic elements for implementing complex digital logic and custom accelerators.
• Embedded Memory  Approximately 8.32 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑chip data storage.
• I/O Resources  372 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package  780‑BBGA (FCBGA) supplier package 780‑FBGA (29×29), optimized for high‑density board integration and surface‑mount assembly.
• Power Supply  Core supply voltage range of 870 mV to 930 mV, providing defined core operating conditions for power planning.
• Operating Temperature  Commercial grade rated from 0 °C to 85 °C for standard temperature environments.
• Mounting  Surface mount package suitable for modern PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High‑density logic implementations  Use the device’s ~118k logic elements to implement complex state machines, protocol engines, or custom datapaths.
• Memory‑intensive buffering  On‑chip embedded memory (approximately 8.32 Mbits) supports data buffering, FIFO queues, and local scratchpad storage.
• I/O‑centric systems  With 372 I/Os, the device is suited to applications requiring broad parallel interfacing or multiple peripheral connections.
• Systems requiring documented transceiver and I/O timing  Arria II device family documentation includes transceiver performance and I/O timing details to aid system integration.

Unique Advantages

• High logic density: 118,143 logic elements enable implementation of large, integrated logic functions on a single device, reducing board count.
• Substantial embedded memory: Approximately 8.32 Mbits of RAM minimizes the need for off‑chip memory for many buffering and data‑storage tasks.
• Extensive I/O: 372 I/Os allow flexible connection to peripherals, wide buses, and multiple external interfaces without external multiplexing.
• Compact, surface‑mount package: 780‑BBGA FCBGA (29×29) provides a high‑density footprint that is compatible with modern PCB assembly flows.
• Defined commercial operating range: Rated for 0 °C to 85 °C to match standard commercial deployments and thermal planning.
• Controlled core voltage window: Core supply range of 870 mV to 930 mV supports predictable power budgeting and supply design.

Why Choose EP2AGX125EF29C4N?

The EP2AGX125EF29C4N positions itself as a high‑density, commercial‑grade Arria II GX FPGA that balances large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package. Its documented device family characteristics for transceiver performance and I/O timing, combined with explicit electrical and package specifications, make it well suited for designers who need verifiable device parameters for system integration and power planning.

This device is appropriate for development teams and procurement looking for an FPGA solution that delivers substantial on‑chip resources in a surface‑mount, RoHS‑compliant package, and that fits within a standard commercial temperature envelope.

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