EP2AGX125EF29C6

The EP2AGX125EF29C6 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers a combination of programmable logic, embedded memory, and I/O capacity targeted for commercial-grade designs.

This device is part of the Arria II GX family and is documented in the Arria II Device Handbook. Key on-chip resources include logic elements, configurable logic blocks, embedded RAM, and 372 I/O pins, with device electrical and switching characteristics and transceiver/clocking performance described in the datasheet.

Key Features

• Logic Capacity  Approximately 118,143 logic elements and 4,964 configurable logic blocks (CLBs) for user-defined digital functions.
• On‑chip Memory  Approximately 8.32 Mbits of embedded memory for data buffering, state storage, and local lookup tables.
• I/O Density  372 I/O pins to support extensive peripheral and interface routing on a single device.
• Power  Core voltage supply specified between 870 mV and 930 mV, enabling controlled core-power budgeting.
• Package & Mounting  780‑BBGA, FCBGA package (supplier package: 780‑FBGA, 29×29); surface-mount mounting type for PCB integration.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Standards  RoHS compliant.
• Device Documentation  Arria II device handbook and datasheet include electrical characteristics, switching characteristics, transceiver specifications, and I/O timing information.

Typical Applications

• Custom digital logic  Leverage the device’s 118,143 logic elements and 4,964 CLBs to implement complex, user-defined digital functions and state machines.
• Memory‑intensive buffering  Use the approximately 8.32 Mbits of embedded RAM for packet buffering, FIFOs, and lookup tables within system logic.
• High‑pin peripheral interfaces  Deploy the 372 I/O pins to connect multiple external devices, sensors, or parallel interfaces without external multiplexing.

Unique Advantages

• Balanced compute and memory: The combination of large logic element count and multi‑Mbit embedded RAM supports integrated compute-plus-storage implementations on a single FPGA.
• High I/O integration: 372 I/Os reduce the need for external interface chips and simplify board-level routing for I/O‑heavy designs.
• Compact, manufacturable package: 780‑FBGA (29×29) surface‑mount package provides a high-density solution suitable for space-constrained PCBs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match standard commercial application environments.
• Controlled core supply: Narrow core voltage range (870 mV–930 mV) allows predictable power budgeting in system design.
• Regulatory compliance: RoHS compliance simplifies environmental and regulatory considerations for assemblies.

Why Choose EP2AGX125EF29C6?

EP2AGX125EF29C6 positions itself as a commercially rated Arria II GX FPGA that combines substantial logic capacity, multi‑Mbit embedded RAM, and a high I/O count in a 780‑ball FCBGA package. The device is suitable for designs that require integrated programmable logic, on‑chip memory, and broad peripheral connectivity while adhering to commercial temperature ranges.

Designers benefit from device-level documentation in the Arria II Device Handbook and datasheet, which detail electrical, switching, transceiver, and I/O timing characteristics required for implementation and validation.

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