EP2AGX125EF29I3

The EP2AGX125EF29I3 is an Arria II GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It provides a high-density programmable logic fabric coupled with multi-megabit on-chip memory and a large number of I/O, suited for industrial-grade embedded designs.

Designed for applications that require significant logic resources and robust operating margins, the device combines 118,143 logic elements with approximately 8.316 Mbits of embedded memory and 372 I/O pins, while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  118,143 logic elements for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 8.316 Mbits of on-chip RAM to support state storage, buffering, and lookup tables.
• I/O Density  372 user I/O pins to interface with peripherals, sensors, and high-pin-count mezzanine connections.
• Core Voltage  Core supply range of 870 mV to 930 mV for the programmable logic and internal circuitry.
• Package & Mounting  780‑ball FCBGA (29×29) package, surface-mount mounting for compact, high-density board layouts.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting demanding environmental conditions.
• Regulatory Compliance  RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

• Custom Digital Processing  Implement high-complexity custom logic and hardware accelerators using 118,143 logic elements and multi-megabit on-chip memory.
• I/O‑Intensive Systems  Interface multiple external devices and sensors with 372 general-purpose I/Os for flexible board-level integration.
• Industrial Control and Instrumentation  Deploy in industrial environments that require operation across −40 °C to 100 °C and robust, surface-mount packaging.

Unique Advantages

• High Logic Density: 118,143 logic elements enable complex design implementation without immediate migration to larger FPGA families.
• Significant On‑Chip Memory: Approximately 8.316 Mbits of embedded RAM reduces external memory needs and simplifies timing-critical designs.
• Large I/O Count: 372 I/Os provide flexibility for diverse peripheral interfaces and parallel data paths.
• Industrial‑Grade Operation: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Compact System Integration: 780‑ball FCBGA (29×29) surface-mount package enables dense PCB layouts while preserving signal routing options.
• Environmentally Compliant: RoHS compliance simplifies regulatory alignment for modern manufacturing processes.

Why Choose EP2AGX125EF29I3?

The EP2AGX125EF29I3 positions itself as a high-density Arria II GX FPGA option for engineers seeking substantial programmable logic, on-chip memory, and broad I/O in a single industrial-grade device. Its combination of 118,143 logic elements, approximately 8.316 Mbits of embedded RAM, and 372 I/Os makes it suitable for complex digital systems where integration density and thermal resilience are important.

With a 780‑ball FCBGA package and surface-mount mounting, the device supports compact board designs while meeting RoHS requirements and operating across a wide industrial temperature range, delivering a robust foundation for long-term projects and scalable hardware platforms.

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