EP2AGX125EF29C5N

The EP2AGX125EF29C5N is an Arria II GX field-programmable gate array (FPGA) from Intel, supplied in a 780-ball FCBGA package (29×29). This commercial-grade, surface-mount device provides a balanced combination of logic capacity, embedded memory, and I/O density for FPGA-based system designs.

Designed for applications that require substantial programmable logic and on-chip memory with a compact BGA footprint, the device is suited to general embedded, communications, and system-integration use where a commercial operating range is acceptable.

Key Features

• Logic Capacity — 118,143 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 8.316 Mbits of on-chip RAM to support buffering, packet handling, and custom memory structures.
• I/O Count — 372 I/O pins to accommodate multiple interfaces and board-level connectivity options.
• Package and Mounting — 780-ball FCBGA (29×29) package, surface-mount for compact board layouts and high-density assemblies.
• Power — Core supply voltage range of 870 mV to 930 mV for defined core power planning and regulator selection.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards — RoHS compliant.

Typical Applications

• Communications and Networking: Use the device for protocol processing, packet buffering, and interface bridging where significant logic and embedded memory are required.
• Embedded Systems: Implement custom control logic, state machines, and peripheral aggregation for compact embedded designs.
• Imaging and Signal Processing: Deploy on designs that require parallel datapaths and on-chip memory for intermediate buffering and processing.

Unique Advantages

• High Logic Density: 118,143 logic elements enable implementation of large custom digital designs without external FPGA partitioning.
• Integrated On-Chip Memory: Approximately 8.316 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage tasks.
• Ample I/O Resources: 372 I/Os allow flexible interfacing to multiple peripherals, sensors, and high-speed connectivity modules.
• Compact Package: 780-ball FCBGA (29×29) provides a small board footprint while supporting dense pinout requirements.
• Commercial Ready: Specified operating range of 0 °C to 85 °C aligns with standard commercial system requirements.
• Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose EP2AGX125EF29C5N?

The EP2AGX125EF29C5N is positioned for designers who need substantial programmable logic and embedded memory in a compact BGA package for commercial applications. Its combination of 118,143 logic elements, approximately 8.316 Mbits of on-chip RAM, and 372 I/Os makes it suitable for complex control, data-path, and interfacing roles where board space and I/O density matter.

Backed by Intel’s Arria II GX device family documentation and electrical characterization, this device is a practical choice for teams seeking a commercially graded FPGA platform that balances capacity, package density, and defined electrical requirements for integration into production designs.

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