EP2AGX125EF29C6N

The EP2AGX125EF29C6N is an Intel Arria II GX field programmable gate array (FPGA) offered in a 780‑FBGA (29×29) surface‑mount package. It provides a large pool of programmable logic, embedded RAM, and a broad I/O count for complex digital designs that require on‑chip reconfigurable logic.

Designed for commercial‑grade applications, the device operates from 0 °C to 85 °C and supports a core voltage supply range of 870 mV to 930 mV. It is RoHS compliant.

Key Features

• Core Logic  Approximately 118,143 logic elements organized across 4,964 logic blocks, enabling substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 8.32 Mbits of on‑chip RAM for buffering, data staging, and state storage within the programmable fabric.
• I/O Capacity  372 I/O pins to support a wide range of external interfaces and board‑level connectivity options.
• Package & Mounting  780‑BBGA / FCBGA package in a supplier 780‑FBGA (29×29) form factor; surface‑mount mounting type for compact board integration.
• Power Requirements  Core supply voltage specified between 870 mV and 930 mV, enabling defined power sequencing and supply design.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C, suitable for commercial electronics environments.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Programmable digital processing  Use the device where substantial programmable logic and on‑chip RAM are needed to implement custom data paths and control logic.
• High‑pin‑count interface bridging  The 372 I/O pins enable board‑level implementations that require multiple external interfaces or parallel data buses.
• Embedded system prototyping  Leverage the Arria II GX device for developing and validating complex FPGA‑based functions in commercial‑grade projects.

Unique Advantages

• High logic density: 118,143 logic elements provide the capacity to implement complex state machines, data processing, and custom accelerators.
• Substantial on‑chip RAM: Approximately 8.32 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Generous I/O count: 372 I/Os allow flexible connectivity options for diverse board‑level architectures.
• Compact surface‑mount package: 780‑FBGA (29×29) balances density and board space for space‑constrained designs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for general commercial deployments.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose EP2AGX125EF29C6N?

The EP2AGX125EF29C6N combines a large programmable fabric, multiple logic blocks, significant embedded RAM, and a high I/O count in a compact 780‑FBGA package. It is positioned for commercial designs that require substantial on‑chip resources and defined electrical and thermal operating ranges.

Its combination of logic capacity, embedded memory, and package density makes it a practical choice for teams implementing complex FPGA functions while maintaining a clear specification for power and operating temperature.

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