EP2AGX125EF29I3G

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA

Quantity 17 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4964Number of Logic Elements/Cells118143
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits8315904

Overview of EP2AGX125EF29I3G – Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA

The EP2AGX125EF29I3G is an Arria II GX family FPGA in a 780-FBGA (29×29) surface-mount package, offered in industrial grade. It integrates a 40‑nm low‑power FPGA engine with rich programmable logic and on‑chip memory to support high-bandwidth system interfaces.

With 118,143 logic elements, approximately 8.3 Mbits of embedded memory and 372 I/Os, this device targets applications that require scalable logic capacity, dense I/O and industry‑grade operating range while leveraging the Arria II family’s support for PCIe, Ethernet and high‑speed serial protocols.

Key Features

  • Logic Capacity — 118,143 logic elements provide substantial combinational and sequential resources for complex logic and control functions.
  • Embedded Memory — Approximately 8.3 Mbits of on‑chip RAM suitable for FIFOs, buffers and embedded data storage.
  • I/O Density — 372 user I/Os to support multiple interfaces and system-level routing.
  • Family-Level Transceiver & Interface Support — Arria II family documentation highlights support for high‑speed serial protocols (for example PCIe, Ethernet, DDR3 interfaces and other protocols) and up to 6.375 Gbps transceiver operation where applicable.
  • DSP and Arithmetic Resources — Family features include DSP blocks and configurable multipliers for signal processing tasks.
  • Package & Mounting — 780‑ball BGA (FCBGA) 29×29 footprint; surface mount form factor for compact board designs.
  • Supply Voltage — Core supply range of 870 mV to 930 mV for compatibility with the Arria II power architecture.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High‑speed Networking — Implement PHY/MAC and packet processing functions using the family’s native support for Ethernet and related serial protocols.
  • PCI Express Endpoints and Bridges — Use for PCIe Gen1/Gen2 physical‑layer and transaction implementations leveraging Arria II PIPE hard IP and transceiver support.
  • Telecommunications & Radio — Deploy in systems requiring CPRI, Serial RapidIO or other serial backhaul interfaces supported by the family.
  • Video and Broadcast Systems — Logical and I/O resources to handle SD/HD/3G SDI and other serial digital interfaces for media transport and processing.
  • Embedded Acceleration — Offload compute kernels using DSP blocks and multiplier configurations for signal processing and algorithm acceleration.

Unique Advantages

  • Significant Logic Density: 118,143 logic elements enable implementation of large, complex designs without immediate need for higher-tier devices.
  • Balanced On‑Chip Memory: Approximately 8.3 Mbits of embedded RAM supports local buffering and reduces external memory bandwidth requirements.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial deployment needs.
  • Broad Interface Capability: Family documentation details dedicated PHY/MAC and serial protocol support, simplifying integration of PCIe, Ethernet and other high‑speed links.
  • Compact Package: 780‑FBGA (29×29) ball map in a surface‑mount form factor enables dense board layouts.
  • Ecosystem Support: Arria II family materials reference Quartus II, SOPC Builder and IP libraries, providing design flow and IP resources to accelerate development.

Why Choose EP2AGX125EF29I3G?

The EP2AGX125EF29I3G positions itself as a high‑capacity Arria II GX FPGA option for designs that require a strong mix of programmable logic, embedded memory and flexible I/O within an industrial temperature envelope. It is suitable for engineers building networking, telecom, broadcast and embedded acceleration systems where family-level interface IP and transceiver capabilities ease integration.

Choosing this device provides long‑term value through ample logic and memory resources, a compact BGA package, and alignment with the Arria II design ecosystem for development and IP reuse.

If you would like pricing, availability or to request a quote for EP2AGX125EF29I3G, please submit a quote request or contact sales for more information.

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