EP2AGX125EF29I3G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA |
|---|---|
| Quantity | 17 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4964 | Number of Logic Elements/Cells | 118143 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8315904 |
Overview of EP2AGX125EF29I3G – Arria II GX Field Programmable Gate Array (FPGA) IC 372 8315904 118143 780-BBGA, FCBGA
The EP2AGX125EF29I3G is an Arria II GX family FPGA in a 780-FBGA (29×29) surface-mount package, offered in industrial grade. It integrates a 40‑nm low‑power FPGA engine with rich programmable logic and on‑chip memory to support high-bandwidth system interfaces.
With 118,143 logic elements, approximately 8.3 Mbits of embedded memory and 372 I/Os, this device targets applications that require scalable logic capacity, dense I/O and industry‑grade operating range while leveraging the Arria II family’s support for PCIe, Ethernet and high‑speed serial protocols.
Key Features
- Logic Capacity — 118,143 logic elements provide substantial combinational and sequential resources for complex logic and control functions.
- Embedded Memory — Approximately 8.3 Mbits of on‑chip RAM suitable for FIFOs, buffers and embedded data storage.
- I/O Density — 372 user I/Os to support multiple interfaces and system-level routing.
- Family-Level Transceiver & Interface Support — Arria II family documentation highlights support for high‑speed serial protocols (for example PCIe, Ethernet, DDR3 interfaces and other protocols) and up to 6.375 Gbps transceiver operation where applicable.
- DSP and Arithmetic Resources — Family features include DSP blocks and configurable multipliers for signal processing tasks.
- Package & Mounting — 780‑ball BGA (FCBGA) 29×29 footprint; surface mount form factor for compact board designs.
- Supply Voltage — Core supply range of 870 mV to 930 mV for compatibility with the Arria II power architecture.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑speed Networking — Implement PHY/MAC and packet processing functions using the family’s native support for Ethernet and related serial protocols.
- PCI Express Endpoints and Bridges — Use for PCIe Gen1/Gen2 physical‑layer and transaction implementations leveraging Arria II PIPE hard IP and transceiver support.
- Telecommunications & Radio — Deploy in systems requiring CPRI, Serial RapidIO or other serial backhaul interfaces supported by the family.
- Video and Broadcast Systems — Logical and I/O resources to handle SD/HD/3G SDI and other serial digital interfaces for media transport and processing.
- Embedded Acceleration — Offload compute kernels using DSP blocks and multiplier configurations for signal processing and algorithm acceleration.
Unique Advantages
- Significant Logic Density: 118,143 logic elements enable implementation of large, complex designs without immediate need for higher-tier devices.
- Balanced On‑Chip Memory: Approximately 8.3 Mbits of embedded RAM supports local buffering and reduces external memory bandwidth requirements.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial deployment needs.
- Broad Interface Capability: Family documentation details dedicated PHY/MAC and serial protocol support, simplifying integration of PCIe, Ethernet and other high‑speed links.
- Compact Package: 780‑FBGA (29×29) ball map in a surface‑mount form factor enables dense board layouts.
- Ecosystem Support: Arria II family materials reference Quartus II, SOPC Builder and IP libraries, providing design flow and IP resources to accelerate development.
Why Choose EP2AGX125EF29I3G?
The EP2AGX125EF29I3G positions itself as a high‑capacity Arria II GX FPGA option for designs that require a strong mix of programmable logic, embedded memory and flexible I/O within an industrial temperature envelope. It is suitable for engineers building networking, telecom, broadcast and embedded acceleration systems where family-level interface IP and transceiver capabilities ease integration.
Choosing this device provides long‑term value through ample logic and memory resources, a compact BGA package, and alignment with the Arria II design ecosystem for development and IP reuse.
If you would like pricing, availability or to request a quote for EP2AGX125EF29I3G, please submit a quote request or contact sales for more information.

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